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A method of manufacturing an electronic component

A manufacturing method and technology of electronic components, applied in chemical instruments and methods, lamination devices, lamination, etc., can solve problems such as appearance, adverse effects on performance, etc.

Active Publication Date: 2017-02-22
SUNLORD (SHANGHAI) ELECTRONICS CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to propose a method for manufacturing electronic components to solve the technical problem in the above-mentioned prior art that the appearance and performance of products after sintering of different materials are adversely affected

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0050] A method for manufacturing a metric 0806 common mode inductor, comprising the following steps: manufacturing an aluminum oxide diaphragm with electrodes and a fired ferrite substrate, laminating the aluminum oxide diaphragm into a green body, and firing the ferrite The substrate and the alumina diaphragm are pressed together to form a green body, and the sintering and densification treatment is completed according to the sintering conditions of the alumina diaphragm, and then the fired billet is cut, deglued, sintered, chamfered, and terminal electrodes are manufactured in sequence and electroplating to complete the manufacture of electronic components.

[0051] Its manufacturing steps are as follows:

[0052] S1, preparing an aluminum oxide film substrate, including steps;

[0053] S11, preparation of powdery mixture:

[0054] 40% by weight of powdered Al2O3 and 60% by weight of borosilicate glass are mixed to prepare a powdery mixture, the preferred particle size of p...

Embodiment 2

[0075] A method for manufacturing a metric 1210 inductor is the same as that in the first embodiment, except that the firing temperature of the substrate is 910° C. for 2 hours. The appearance of the electronic component prepared by the method has no deformation and cracks, and the electric property is close to 90% of the theoretical value.

Embodiment 3

[0077] A method for manufacturing metric 0605 inductors, the same as the specific embodiment 1, the difference is that the film substrate is a mixture of 20% to 30% by weight of Al2O3 and 70% to 80% by weight of boron oxide glass material, and the The sintering temperature after laminating the film substrates with conductive electrodes to form a green body is 860° C. for 2 hours. The appearance of the electronic component prepared by the method has no deformation and crack, and the electric property is close to 92% of the theoretical value.

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PUM

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Abstract

The invention discloses a manufacturing method of an electronic element. The manufacturing method comprises the following steps: S1. preparing a film substrate; S2. preparing a fired substrate, wherein the fired substrate is different from the film substrate in material; S3. gluing the film substrate and the fired substrate to form a green body; and S4. sintering the green body under a film substrate sintering condition. The manufacturing method can effectively prevent the adverse effect of internal stress caused by sintering shrinkage difference on the electrical property and the appearance of the electronic element in a co-firing process of the two materials.

Description

technical field [0001] The invention relates to the field of manufacturing electronic components, in particular to a method for manufacturing electronic components manufactured in a pasting manner. Background technique [0002] With the continuous development of artificial intelligence technology, signals in different frequency bands need to be processed in actual circuits, which puts forward higher requirements for electronic components. In order to meet the multiple uses of the same electronic component, the traditional single material manufacturing Electronic components can no longer meet the needs of use. It is necessary to introduce two or more materials to meet the design requirements. However, at present, the appearance and electrical performance of electronic components made of more than two materials often have poor conditions. Contents of the invention [0003] After studying the above-mentioned electronic components with bad conditions, it is found that under th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B18/00
CPCB32B18/00B32B37/10B32B37/144
Inventor 郑卫卫戴春雷
Owner SUNLORD (SHANGHAI) ELECTRONICS CO