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Multilayer long-distance fluorescent powder coated LED packaging unit, die and manufacturing method

A technology of LED packaging and phosphor layer, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve problems such as disturbing chip light, affecting optical performance, and reducing phosphor life, so as to avoid shortening life and improve reliability.

Inactive Publication Date: 2015-04-08
HKUST LED FPD TECH R&D CENT AT FOSHAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The phosphor powder is directly coated on the periphery of the chip, which means that the light emitted from the chip touches the phosphor powder. This light output mode has two disadvantages: 1. Part of the light is directly reflected back to the chip by the phosphor powder, and this part of the light disturbs the light emitted by the chip.
2. The heat generated by the chip is directly transmitted to the phosphor layer, which accelerates the temperature rise of the phosphor, directly damages and reduces the life of the phosphor, and causes LED lamp reliability problems
But mixing powder has three disadvantages: 1) The yellow light emitted by the yellow powder will be absorbed by the red powder with low quantum efficiency, reducing the overall light efficiency
2) Different phosphors are not necessarily evenly distributed in the fluorescent glue, which affects the optical performance
3) It is difficult to calculate the appropriate phosphor ratio to achieve ideal optical performance

Method used

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  • Multilayer long-distance fluorescent powder coated LED packaging unit, die and manufacturing method
  • Multilayer long-distance fluorescent powder coated LED packaging unit, die and manufacturing method
  • Multilayer long-distance fluorescent powder coated LED packaging unit, die and manufacturing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1L

[0043] Embodiment 1 LED packaging unit embodiment

[0044] see figure 1 , The LED packaging unit provided by the present invention includes a substrate 1 , an LED chip 2 , a silica gel layer 3 , and a multi-layer phosphor layer 4 . Wherein, the LED chip 2 is fixed on the upper surface of the substrate 1 . The silicone layer 3 is fixed on the upper surface of the substrate 1 and covers the exposed surface of the LED chip 2 . The silicone layer 3 includes two parts, namely a convex main body 31 with an upwardly convex outer contour, and a stepped extension part 32 surrounding the bottom edge of the convex main body 31 . The stepped extension portion 32 has at least two steps. The number of layers of the phosphor layer 4 is consistent with the number of steps of the stepped epitaxial part 32 . For ease of description, the step 33 closest to the convex body 31 of the silicone layer 3 is called the first step, and a layer of phosphor layer 41 covers the surface of the horizonta...

Embodiment 2

[0047] Embodiment 2 Mold embodiment

[0048] This embodiment provides a mold 5 for preparing the silicone layer 3 with a specific structure of the LED packaging unit described in Embodiment 1. see Figure 4 . This mold 5 comprises a mold body 52, and the top surface of the mold body is sunken inwards to form an inner cavity 51 for pouring silica gel. This inner cavity 51 has the following characteristics, its bottom 53 is concave, and its top edge 54 Extend all around and form steps. The concave contour of the bottom 53 of the inner cavity 51 of the mold is preferably arc-shaped, or called hemispherical. The material of the mold can specifically be aluminum. The specific specifications of the mold are determined according to the chip specifications and light emission requirements. The width of the horizontal step surface of each step of the stepped top edge 54 is determined according to the required thickness of each phosphor layer.

Embodiment 3

[0049] Embodiment 3 Preparation example of LED packaging unit

[0050] This embodiment provides an embodiment of a method for preparing the LED package unit of Embodiment 1 by using the mold of Embodiment 2.

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Abstract

The invention provides an LED packaging unit and a manufacturing method and a die of the LED packaging unit. The LED packaging unit comprises a substrate, an LED chip, a silica gel layer and at least two fluorescent powder layers, wherein the LED chip is fixedly arranged on the upper surface of the substrate, and the silica gel layer is fixedly arranged on the upper surface of the substrate, wraps the LED chip and comprises a convex body and a stepped epitaxy portion, the external outline of the convex body is of an upwards-convex structure. The number of the at least two fluorescent powder layers is consistent to the step number of the stepped epitaxy portion of the silica gel layer, the first-layer fluorescent powder layer covers the upper surface of the horizontal step face adjacent to the convex body in the stepped epitaxy portion and inwards covers the outer surface of the convex body, and the remaining fluorescent powder layers are sequentially stacked on the outer surface of the first-layer fluorescent powder layer from inside to outside. The multilayer long-distance fluorescent powder coated LED packaging unit has good reliability.

Description

technical field [0001] The invention relates to the technical field of LED encapsulation, in particular to an LED encapsulation unit, a mold and a preparation method for multi-layer remote coating phosphor powder. Background technique [0002] LED (Light Emitting Diode) is a solid-state semiconductor device that can directly convert electrical energy into light energy. It changes the principle of incandescent lamp tungsten filament luminescence and energy-saving lamp three-based toner luminescence, and uses electric field luminescence. The characteristics of LED are very obvious, the main features are long life, high luminous efficiency, low radiation and low power consumption. The spectrum of white LEDs is almost entirely concentrated in the visible light band, and its luminous efficiency can exceed 150lm / W. [0003] LED packaging refers to the packaging of light-emitting chips, which is quite different from integrated circuit packaging. The packaging of the LED is not o...

Claims

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Application Information

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IPC IPC(8): H01L33/50H01L33/54H01L33/00
CPCH01L33/50H01L33/504H01L33/505H01L33/54H01L2933/0041H01L2933/005
Inventor 李世玮卢智铨
Owner HKUST LED FPD TECH R&D CENT AT FOSHAN