Thin film flip chip packaging structure
A film-on-chip packaging and flexible technology, which is applied in the direction of electrical components, electrical solid devices, circuits, etc., can solve the problems of limited heat dissipation efficiency and insufficient heat dissipation efficiency, and achieve the effect of increasing strength and improving heat dissipation efficiency
Inactive Publication Date: 2015-04-15
CHIPMOS TECH INC
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Problems solved by technology
However, in the configuration of the above-mentioned heat sink, the heat energy generated during the operation of the chip can only be transmitted to the heat sink through the flexible film substrate with poor thermal conductivity, and its heat dissipation efficiency is limited. Under the design trend of frequency, it is known that the heat dissipation efficiency of the heat sink attached to the other surface of the flexible film substrate is not enough, so it is necessary to improve the heat dissipation package structure of the known chip
Method used
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Embodiment Construction
[0044] figure 1 It is a schematic partial cross-sectional view of a chip-on-film packaging structure according to an embodiment of the present invention. figure 2 for figure 1 A partial top view of the thin film chip-on-chip packaging structure, wherein the encapsulant 140 is omitted for clarity and illustration. Please refer to figure 1 , in this embodiment, the film-on-chip package structure 100 includes a flexible substrate 110 , a chip 120 , a heat sink 130 and an encapsulant 140 .
[0045] The flexible substrate 110 includes a flexible dielectric layer 112 , a plurality of pins 114 and a solder resist layer 116 , wherein the flexible dielectric layer 112 has a first surface 112 a and a second surface 112 b. The pins 114 are formed on the first surface 112 a of the flexible dielectric layer 112 , and the solder resist layer 116 is disposed on the first surface 112 a and partially covers the pins 114 to prevent the pins 114 from being short-circuited due to exposure and...
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Abstract
The invention provides a thin film flip chip packaging structure comprising a flexible base plate, a chip, a heat dissipation sheet and a packaging rubber body. The flexible base plate comprises a flexible dielectric layer and a plurality of lead pins; the flexible dielectric layer is provided with a first surface, a second surface and a plurality of via holes; the lead pins are formed on the first surface and comprise one or more virtual lead pins, the via holes correspond to the virtual lead pins, the chip is arranged on the first surface of the flexible dielectric layer and is provided with an active surface and a plurality of protruding blocks configured on the active surface, the protruding blocks are respectively connected with the lead pins, the heat dissipation sheet is positioned on the second surface of the flexible dielectric layer and is provided with a plurality of virtual protruding blocks, the virtual protruding blocks penetrate into the via holes, the heat dissipation sheet is connected with the virtual lead pins through the virtual protruding blocks, and a gap between the chip and the flexible base plate is filled with the packaging rubber body.
Description
technical field [0001] The present invention relates to a package structure, and in particular to a chip-on-film package structure. Background technique [0002] With the improvement of semiconductor technology, liquid crystal displays have the advantages of low power consumption, thin and light weight, high resolution, high color saturation, and long life, so they are widely used in mobile phones, notebook computers or desktop computers. LCD screens and LCD TVs and other electronic products that are closely related to life. Among them, the driver IC of the display is an indispensable and important component of the liquid crystal display. [0003] In response to the needs of various applications of liquid crystal display device driver chips, chip packaging is generally carried out by using automatic tape and reel packaging technology, including chip on film (Chip On Film, COF) packaging, tape carrier package (Tape Carrier Package, TCP) )Wait. Tape automatic bonding packag...
Claims
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Login to View More IPC IPC(8): H01L23/31H01L23/367
Inventor 杨佳达
Owner CHIPMOS TECH INC