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A preparing method of a film chip

A thin-film chip and thin-film technology, which is applied in the field of thin-film chip preparation, can solve the problems of high process equipment requirements, high manufacturing cost, and difficulty in industrialization and promotion, and achieve the effects of simple operation process, low cost, and simple method.

Inactive Publication Date: 2015-04-22
CHONGQING XUXING CHEM
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Thick and thin-film elements have the advantages of high sensitivity, repeatability, good stability, low power consumption, and long life. However, the production of thin-film elements requires high process equipment, high manufacturing costs, and is not easy to promote industrialization.

Method used

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  • A preparing method of a film chip

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preparation example Construction

[0023] Such as figure 1 Shown, a kind of film chip preparation method comprises the steps:

[0024] Make a positive mold with photoresist, and carry out silanization treatment on the prepared positive mold;

[0025] Mix PDMS prepolymer and curing agent evenly, remove air bubbles, and apply on the silanized positive mold;

[0026] Coating with a gluing machine to form a uniform PDMS film and cure it;

[0027] Use a puncher to punch holes on the middle layer PDMS film at positions corresponding to the end points of the lower layer liquid channels;

[0028] Remove the cured bottom PDMS chip from the positive mold, put the side with the channel up and the cured middle PDMS film into the plasma cleaner for cleaning;

[0029] Lay the side of the bottom PDMS chip with the channel to the side of the middle PDMS thin film chip without the channel.

Embodiment 1

[0031] Make a positive mold with photoresist, and carry out silanization treatment on the prepared positive mold; mix 10g PDMS prepolymer with 1g curing agent evenly, remove air bubbles, and apply it on the silanized positive mold; Coat at 1000rpm for 20s to form a uniform PDMS film with a thickness of about 30μm, the same length and width as the bottom PDMS chip, and cure at 50°C; use a puncher to create a liquid channel between the middle PDMS film and the bottom layer Punch holes at the positions corresponding to the end points; remove the cured bottom PDMS chip from the male mold, put the side with the channel up and the cured middle PDMS film into the plasma cleaner for cleaning for 30s; The side of the bottom PDMS chip with the channel is attached to the side of the middle PDMS thin film chip without the channel.

Embodiment 2

[0033] Make a positive mold with photoresist, and carry out silanization treatment on the prepared positive mold; mix 15g PDMS prepolymer with 1g curing agent evenly, remove air bubbles, and apply it on the silanized positive mold; Coat at 1500rpm for 30s to form a uniform PDMS film with a thickness of about 35 μm, the same length and width as the bottom PDMS chip, and cure at 60°C; use a puncher to create a liquid channel on the middle PDMS film and the bottom layer Drill holes at the positions corresponding to the end points; remove the cured bottom PDMS chip from the male mold, put the side with the channel up and the cured middle PDMS film into the plasma cleaner for cleaning for 50s; The side of the bottom PDMS chip with the channel is attached to the side of the middle PDMS thin film chip without the channel.

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Abstract

The invention relates to a preparing method of a film chip. The preparing method includes following steps of: manufacturing a male mold by using a photoresist, subjecting the manufactured male mold to silanization processing, uniformly mixing a PDMS precursor polymer and a curing agent, removing air bubbles, coating the male mold subjected to silanization processing with the mixture, coating with a spin coater to form uniform PDMS films, curing, punching at positions in a middle-layer PDMS film which are corresponding to end points of a lower-layer liquid channel by using a hole puncher, uncovering a cured base-layer PDMS chip from the male mold, putting the chip with the surface having the channel being upward together with the cured middle-layer PDMS film into a plasma cleaning machine, cleaning, and adhering the channel-containing surface of the base-layer PDMS chip to the channel-free surface of the middle-layer PDMS film. The method is simple, simple in operation process and low in cost. The chip is stable in performance and prone to quantity production.

Description

technical field [0001] The invention relates to a method for manufacturing a semiconductor device, in particular to a method for preparing a thin film chip. Background technique [0002] Semiconductor gas sensors are divided into sintered type, thick film type and thin film type. Their respective structures and manufacturing processes are different, and their performance characteristics are also different. Currently, sintered components are gradually being replaced by thick, thin-film components. Thick and thin-film elements have the advantages of high sensitivity, repeatability, good stability, low power consumption, and long life. However, the production of thin-film elements requires high process equipment, high manufacturing costs, and is not easy to promote industrialization. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide a thin film chip preparation method with simple method, simple operation process, lo...

Claims

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Application Information

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IPC IPC(8): G01N33/00
Inventor 周祖渝
Owner CHONGQING XUXING CHEM