Efficient soldering tin protective agent

A protective agent and high-efficiency technology, applied in the field of chemical industry, can solve the problems of solder oxidation, affect the welding quality of electronic components, and cannot completely solve the oxidation problem, and achieve the effect of stable anti-oxidation performance.

Inactive Publication Date: 2015-04-29
戴留庆
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

During the soldering process of electronic components, it is necessary to melt the solder in the solder tank in advance. These molten solders need to be shielded and protected to avoid oxidation in the air, which will affect the soldering quali

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0007] Example 1, a high-efficiency solder protection agent, prepared by percentages from the following raw materials: high-viscosity dimethicone 5%, tripalmitoleic acid glyceride 5%, arachidonic acid 5%, liquid polybutene 5 %, vacuum residue 40%, amine antioxidant 0.5%. The above raw materials are mixed and melted into a uniform paste at a temperature of about 100-140°C.

Example Embodiment

[0008] Example 2, a high-efficiency solder protection agent, prepared by percentages from the following raw materials: high viscosity simethicone 12.5%, tripalmitoleic acid glyceride 7.5%, arachidonic acid 7.5%, liquid polybutene 7.5% %, vacuum residue 45%, amine antioxidant 1.75%. The above raw materials are mixed and melted into a uniform paste at a temperature of about 100-140°C.

Example Embodiment

[0009] Example 3, a high-efficiency solder protection agent, prepared by percentages from the following raw materials: high-viscosity simethicone 20%, tripalmitoleic acid glyceride 10%, arachidonic acid 10%, liquid polybutene 10 %, vacuum residue 50%, amine antioxidant 2%. The above raw materials are mixed and melted into a uniform paste at a temperature of about 100-140°C.

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PUM

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Abstract

The invention relates to the technical field of chemical industry, in particular to an efficient soldering tin protective agent. The efficient soldering tin protective agent is prepared from, by weight, 5-20% of high-viscosity dimethicone, 5-10% of palmitoleic triolein, 5-10% of arachidonic acid, 5-10% of liquid polybutylene, 40-50% of vacuum residue and 0.5-2% of amine antioxidant. The raw materials are mixed and molten into uniform grease at the temperature of 100-140 DEG C. The efficient soldering tin protective agent is stable in performance.

Description

technical field [0001] The invention relates to the technical field of chemical industry, in particular to a high-efficiency solder protectant. Background technique [0002] With the development of the electronics industry, the amount of solder is increasing. Soldering is one of the most important processes in the assembly of the electronics industry. Its quality directly affects the reliability and stability of electronic products. Especially in the molten state, they are easy to react with oxygen in the air to form a denser layer. Oxide film. The oxide film can prevent the tin or tin alloy melt from being further oxidized when the tin or tin alloy melt is in a static state. During the soldering process of electronic components, the solder needs to be melted in the solder pot in advance, and the molten solder needs to be shielded to avoid oxidation in the air, which will affect the soldering quality of the electronic components. The method of using a closed container to ...

Claims

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Application Information

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IPC IPC(8): B23K35/363
CPCB23K35/3612B23K35/362
Inventor 戴留庆
Owner 戴留庆
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