Photoelectric detection integrated chip

Abstract

The invention relates to the field of visible light communication and discloses a photoelectric detection integrated chip. The photoelectric detection integrated chip comprises a PCB (Printed Circuit Board) and a PD (photoelectric diode) array, wherein a photoelectric signal processing circuit is integrated into the PCB; the PD array is positioned on the PCB; each PD in the PD array is provided with an anode and a cathode; the PCB is provided with anode bonding pads and cathode bonding pads which correspond to the anodes and the cathodes one by one; the anodes are electrically connected with the anode bonding pads; the cathodes are electrically connected with the cathode bonding pads. Compared with the prior art, PD bare chips are directly and electrically connected with a photoelectric signal processing circuit in the PCB and parasitic resistance and parasitic inductance effects are reduced so as to improve sensitivity of the photoelectric signal processing circuit, therefore, performance of the integral photoelectric detection integrated chip is improved; moreover, the photoelectric detection integrated chip adopts a simple process, is low in cost, has a high rate of finished products and is suitable for industrial production.

Description

technical field [0001] The invention relates to the field of visible light communication, in particular to a photoelectric detection integrated chip. Background technique [0002] As a solid-state light source, white LED has the advantages of high luminous efficiency, small size, and long life. It will replace traditional lighting equipment and become the next generation of environmentally friendly lighting sources. As a semiconductor photonic device, the fast response characteristic of white light LED makes it have the characteristics of high-speed modulation, which can modulate the signal to the LED light source for data transmission at a speed that cannot be perceived by human eyes. Based on the above-mentioned characteristics of LED, a new technology of deeply coupling lighting and data transmission, that is, visible light communication technology (visible light communication, VLC), has been produced. As an optical wireless communication technology, VLC technology has t...

AI Technical Summary

Problems solved by technology

[0006] The preparation of the traditional PIN photodiode array is realized on a semiconductor substrate through a special process, using the substrate photosensitive mode, and the interconnection with the integrated circuit is flip-chip soldered through the bumps on the front of the PIN chip and the pads on the integration. Flip-chip connection, this method can greatly reduce parasitic effects and reduce the size of the system, but it has high requirements on the process, high cost, prone to defective products in the production process, and virtually increases the economic cost. Not conducive to the market competitiveness of the product

Images