Selective sintering process of printed circuit

A printed circuit, selective technology, applied in the direction of printed circuit, printed circuit manufacturing, electrical components, etc., can solve the problems of poor electrical conductivity, etc., and achieve the effect of high line environment reliability, improved circuit electrical conductivity, and high conductivity
CN104582283AInactive Publication Date: 2015-04-29XIAMEN PINGDA TRADING CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
XIAMEN PINGDA TRADING CO LTD
Publication Date
2015-04-29
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention discloses a selective sintering process of a printed circuit. A non-conducting material is selected for manufacturing a base material; the surface of the base material is covered with conducting ink through a printing process; the base material covered with the conducting ink is placed aside so as to remove a solvent in the conducting ink after the conducting ink is dried, or the base material covered with the conducting ink is placed in a baking furnace to be baked at a temperature lower than the softening temperature or denaturation temperature of the base material so as to remove the solvent in the conducting ink; induction heating equipment is used for carrying out induction heating on the base material which has been dried or baked at the low temperature, namely, the base material which has been dried or baked at the low temperature is placed near an induction coil, an electric induction furnace of a specific frequency is selected according to the base material and the conducting ink material, power is adjusted, heating time is set, and heating is carried out; after heating is completed, the printed circuit product can be obtained. By means of the process, selective heating of the printed circuit is achieved, namely, heating is only carried out on the conducting material but not the non-conducting base material, and therefore high-temperature sintering of the printed circuit is achieved, and good electric conductivity is achieved.
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Description

technical field

[0001] The invention relates to a printing and sintering process, in particular to a selective sintering printed circuit process. Background technique

[0002] A printed circuit is an electronic circuit that etches or sensitizes a conductor pattern on an insulating substrate by printing means, and is an electronic circuit that connects electronic components to each other. It has been able to use an automatic plotter to quickly draw the conductor graphics directly on the glass plate to make a plate, and then print it out. Printed circuits make mass production of electronic devices simple and easy, making electronic devices consistent in performance, stable in quality, and compact in structure. Such advances in electronic equipment since the 1950s would not have been possible without printed circuit technology.

[0003] In the prior art, when the printed circuit is processed and produced, the conductive paste is printed on the resin substrate, and then the wo...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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