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Heat sink and communication products

A heat dissipation device and product technology, applied in the field of communication, can solve the problems of blocking natural convection of air, large temperature gradient, large temperature gradient of radiator substrate, etc., and achieve the effect of ensuring normal operation, high heat dissipation efficiency and light weight

Active Publication Date: 2017-10-17
HUAWEI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The disadvantage of this heat dissipation structure is: the heat dissipation effect of the radiator is poor, and the temperature gradient of the metal shell of the flat panel antenna is large, that is, the temperature gradient of the radiator substrate is large.
The disadvantage of this heat dissipation structure is that the fan frame needs to be driven and powered, which complicates the internal structure of the panel antenna and increases the volume of the panel antenna.
Moreover, when the fan fails, the fan frame becomes a resistance member, blocking the natural convection of the surrounding air, which is not conducive to heat dissipation

Method used

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  • Heat sink and communication products
  • Heat sink and communication products
  • Heat sink and communication products

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Embodiment Construction

[0029] The technical solutions in the embodiments of the present invention will be clearly described below with reference to the drawings in the embodiments of the present invention.

[0030] see Figure 5 to Figure 8 , which is a schematic diagram of the communication product 100 . The communication product 100 may be a flat panel antenna, a base station, a server, and the like. The communication product 100 includes a cover body 10, a heat dissipation device 20 and a heating element 30, the cover body 10 and the heat dissipation device 20 cooperate with each other to form a shell of the communication product 100, and the heating element 30 is arranged on the communication product 100 the inside of the enclosure. The heating element 30 is a radio frequency board or a power amplifier board or a circuit board integrating radio frequency and power amplifier functions.

[0031] see Figure 1 to Figure 4 , Figure 1 to Figure 4 A schematic diagram of the heat sink 20 is shown...

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Abstract

The invention relates to a heat dissipation device, comprising an inner wall and an outer wall, the inner wall and the outer wall are partially attached to each other, and a multi-channel pipeline is formed between the inner wall and the outer wall, and a working medium is arranged in the multi-channel pipeline, and the The inner wall includes an evaporation area and a condensation area. The condensation area is located above the evaporation area. The multi-channel pipeline extends from the evaporation area to the condensation area. The heating element of the communication product is directly or indirectly attached to the position of the evaporation area on the inner wall. The heat generated by the heating element causes the working fluid to vaporize and flow to the condensation zone, and the gaseous working fluid flows back to the evaporation zone after being cooled and liquefied in the condensation zone. The heat dissipation device of the present invention has the advantages of high heat dissipation efficiency, small size and light weight. The invention also provides a communication product.

Description

technical field [0001] The invention relates to the technical field of communications, in particular to a heat dissipation device and a communication product using the heat dissipation device. Background technique [0002] Flat panel antenna is an important technical direction for future wireless communication development. The heating element in the panel antenna generates heat during operation, and a cooling device is required to dissipate heat from the heating element, so as to ensure the normal operation of the panel antenna and prolong the life of the heating element. [0003] The heat dissipation structure of a flat panel antenna in the prior art is: add a radiator to the outer surface of the metal casing of the flat antenna. The metal casing is usually a metal plate structure, and the radiator is usually an aluminum profile radiator. The heat emitted by the components is conducted to the heat sink, and then the heat is dissipated by the heat sink. The disadvantages o...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20
Inventor 鹿化文洪宇平陈伟
Owner HUAWEI TECH CO LTD