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Spray forming cooling system and method for decreasing temperature of ingot blank through spray forming cooling system

A spray forming and billet technology, applied in the field of spray forming cooling system, can solve the problems of lack of demand, the influence of microstructure, mechanical properties and machining performance, etc., and achieve fast cooling speed, high heat absorption efficiency and good mechanical properties. Effect

Active Publication Date: 2015-05-20
天津佐源新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

During the entire spray forming process, the condensation of the metal liquid column releases a large amount of heat, part of which is discharged from the air outlet installed on the atomization box, but the other part of the heat is gathered in the atomization chamber, causing the temperature of the atomization chamber to rise rapidly. High, the atomization room temperature is too high, it will affect the cooling rate and the temperature of the ingot itself, the cooling rate of the ingot is too slow, the crystals constituting the ingot are thick, and its mechanical properties and machining properties are greatly affected. It can even result in organizations that don't get what they need
Therefore, it is necessary to find a way to cool the spray chamber, and the existing equipment does not have a cooling system

Method used

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  • Spray forming cooling system and method for decreasing temperature of ingot blank through spray forming cooling system
  • Spray forming cooling system and method for decreasing temperature of ingot blank through spray forming cooling system
  • Spray forming cooling system and method for decreasing temperature of ingot blank through spray forming cooling system

Examples

Experimental program
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Effect test

Embodiment 1

[0049] Such as Figure 2-4 As shown, an injection molding cooling system includes an injection molding device and a cooling system, and the cooling system includes a heat absorbing structure, a cooling device 24, a circulating power pump 26, a heat transfer medium and a heat transfer medium delivery pipeline, and the heat transfer medium delivers Pipelines sequentially connect the heat absorbing structure, the cooling device 24 and the circulating power pump 26 to form a heat conduction circuit;

[0050] The heat absorbing structure is located in the atomization chamber 10 of the injection molding device for cooling the ingot 5 or the tray 6, and the cooling device 24 is located outside the atomization chamber 10 of the injection molding device for cooling due to The heat conduction medium whose temperature rises after absorbing the heat of the atomization chamber 10;

[0051] The heat transfer medium circulates in the heat conduction circuit under the action of the circulati...

Embodiment 2

[0072] Such as Figure 5-6As shown, compared with Embodiment 1, the difference of this embodiment is that the structure of the heat-absorbing structure is different. The heat-absorbing structure of this embodiment is as follows: the bottom of the tray 6 is airtightly fixed with an inner heat-conducting sleeve 27, forming The inner wall of the inner heat conduction sleeve 27 and the bottom of the tray 6 enclose an inner heat conduction chamber, the inner heat conduction sleeve 27 is externally connected to the outer heat conduction sleeve 28, and the outer heat conduction sleeve 28 is fixed on the fixed sleeve 30, The side wall of the inner heat-conducting sleeve 27 is provided with a heat-conducting medium inlet 17 and a heat-conducting medium outlet 15, and the position of the outer heat-conducting sleeve 28 corresponding to the heat-conducting medium inlet 17 is provided with a first annular groove 281, and the heat-conducting medium The delivery pipeline passes through the ...

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PUM

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Abstract

The invention discloses a spray forming cooling system and a method for decreasing the temperature of an ingot blank through the spray forming cooling system. The system comprises a spray forming device and a cooling system, the cooling system comprises a heat absorption structure, a cooling device, a circulation power pump, heat conduction media and a heat conduction medium conveying pipeline which is sequentially connected with the heat absorption structure, the cooling device and the circulation power pump to form a heat condition loop. The heat absorption structure is located inside an atomization chamber of the spray forming device and used for cooling the ingot blank or a tray, and the cooling device is located outside the atomization chamber of the spray forming device and used for cooling the heat conduction media of which the temperature is increased because heat of the atomization chamber is absorbed. The heat conduction media flow inside the heat conduction loop in a circulation mode under the action of the circulation power pump to absorb heat in the atomization chamber and perform cooling inside the cooling device. The spray forming cooling system has the advantage that the heat conduction media are adopted for directly cooling the ingot blank or the tray, so that the ingot blank of which the performance meets the requirement is obtained.

Description

technical field [0001] The invention relates to the field of metal material ingot spray forming, in particular to a spray forming cooling system and a method for reducing the temperature of an ingot by using the system. Background technique [0002] The ingot spray forming technology is an advanced technology that makes the liquid metal alloy form solid, semi-solid, liquid mist micro-particles deposited on the receiver to form an ingot under the action of inert gas. [0003] The atomization chamber structure of the ingot spray forming in the prior art is as follows: figure 1 As shown, it includes a leak bag, a metal liquid column, an atomizer, an air inlet, an ingot, a tray, a rotating shaft, a moving shaft, an air outlet, and an atomizing box. During work, the inert gas for atomizing the metal is sprayed into the atomization chamber through the atomizer through the air inlet. The liquid column is atomized into tiny solid, semi-solid or liquid fine metal particles by the i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F3/115
CPCB22F3/003B22F3/115
Inventor 李珮豪冯永信李海军
Owner 天津佐源新材料科技有限公司
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