Silicon wafer grinding and optical polishing system and machining technology thereof

Abstract

The invention discloses a silicon wafer grinding and optical polishing system comprising a heating device, a vertical-shaft plane milling and grinding machine and a one-face silicon dioxide polishing machine. The heating device comprises a heating base and a round carrier disk. The upper surface of the carrier disk is a smooth plane. An adhesion wax layer is arranged between silicon wafers and the carrier disk. The vertical-shaft plane milling and grinding machine comprises a first machine frame and a first workbench. Multiple round cavities matched with the carrier disk are formed in the first workbench. A diamond grinding plate is arranged above the first machine frame. According to the silicon wafer grinding and optical polishing system, through mutual cooperation of the heating devices, the vertical-shaft plane milling and grinding machine and the one-face silicon dioxide polishing machine, grinding sand is omitted in the grinding process, emission of waste is reduced, the production efficiency is improved, the rate of finished products is improved, and production cost is reduced.

Description

technical field [0001] The invention relates to the field of silicon wafer grinding optics, in particular to a silicon wafer grinding optical polishing system and a processing technology thereof. Background technique [0002] At present, the surface of silicon wafers needs to be mass-produced by optical grinding and polishing. There are two processes used. The first is the double-sided grinding and polishing process of silicon wafers: silicon wafer thickness classification→diamond double-sided grinding machine grinding→silicon wafer thickness classification→dioxide Silicon double-sided polishing machine polishing; the second is the silicon wafer single-sided grinding and polishing process: silicon wafer thickness classification → emery double-sided grinding machine grinding → silicon wafer thickness classification → use wax to attach the silicon wafer to the carrier plate → silicon dioxide Single side polishing machine polishing. [0003] However, the two processes in the e...

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Problems solved by technology

[0003] However, the two processes in the existing production activities have to use abrasive sand for grinding, which is expensive and wasteful; the double-sided grinding silicon wafer is ground in a free state, and it takes 80 to 100 minutes to grind once, and the whole vehicle is ground As long as one piece of the silicon wafer is broken, more than 50% of the whole vehicle silicon wafer will be scrapped, so the yield rate is not high

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