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Full-automatic electronic printing unit and method

An electronic printing, fully automatic technology, applied in printing devices, printing, typewriters, etc., can solve the problems of complex manufacturing procedures, high environmental pollution, high material and energy consumption, and achieve low material ineffective loss, low environmental requirements, low cost effect

Active Publication Date: 2015-05-20
TECHNICAL INST OF PHYSICS & CHEMISTRY - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a fully automatic electronic printing device and printing method that can directly transfer printed circuits and electronic devices to solve the problem of complex manufacturing procedures, large material and energy consumption, and problems with existing circuits or electronic devices. The problem of relatively high environmental pollution provides a new tool for the emerging field of printed electronics

Method used

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  • Full-automatic electronic printing unit and method
  • Full-automatic electronic printing unit and method

Examples

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Effect test

Embodiment 1

[0058] Such as figure 1 and 2 As shown, the fully automatic electronic printing device of the present invention includes a computer 1, a printing box 100, and the printing box 100 is provided with a paper feeding mechanism, a slide rail 2, a printing mechanism, a temperature control device 6 and a state sensor. The computer 1 is used to generate printing control instructions. Specifically, the computer 1 is installed with a DIY electronic drawing program and a structure database for automatic design of electronic circuits and electronic devices and generation of printing control instructions. Users can design electronic circuit patterns that need to be printed on the computer, and generate structural printing instructions. The paper feeding mechanism is arranged at the bottom of the printing box, which includes a base 88, a conveying unit and a paper feeding control module; the conveying unit is installed on the base, and the conveying unit is used to convey the printing car...

Embodiment 2

[0075] Figure 4 It is a structural schematic diagram with three ball printing heads in the present invention. This embodiment is different from Embodiment 1 in that it does not need to stop the machine to replace the printing pen to realize multi-attribute electronic printing, and the printing mechanism can not only use one, but can simultaneously provide the printing mechanism of conductive ink and the printing mechanism of P-type semiconductor ink The three printing pens and the corresponding software and hardware control mechanisms can be selected in sequence according to the needs of specific circuits or cooperate with printing at the same time, thereby realizing the production of electronic circuits or devices with specific functions. In addition, two or four printing mechanisms can also be used for printing, and the number of printing mechanisms is determined by the type of the printed product. In this embodiment, the working mode is completely consistent with that of ...

Embodiment 3

[0077] Figure 5 It is a schematic structural diagram of a ball transfer ink type automatic electronic printing device for printing on the surface of a three-dimensional object in the present invention. The difference between this embodiment and Embodiment 1 is that the conveying unit is installed on the base through a three-dimensional moving unit Above, the three-dimensional moving unit drives the three-dimensional movement of the conveying unit and the printing carrier conveyed by the conveying unit along X, Y and Z directions. In this embodiment, the mechanism arm 91 is used as the three-dimensional moving unit. The conveying unit includes a cylinder clamping assembly 12 and a motor 11, the printing carrier is clamped by the cylinder clamping assembly 12, and is arranged on the outer surface of the cylinder clamping assembly, the motor 11 is connected with the cylinder clamping assembly, and Drive cylinder clamping assembly to rotate. During printing, the conveying unit ...

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Abstract

The invention relates to the field of direct printing of printed circuit boards and electronic devices, in particular to a full-automatic electronic printing unit and method based on ball driven delivery and transfer printing of electronic ink. The unit comprises a control module, an electronic computer, a slide rail, a slider and a ball printing mechanism; the ball printing mechanism comprises a ball printing head of electronic ink. The electronic ink is continuously delivered and attached to the outer side of a ball until that the electronic ink is spread to the surface of a printing material, through rotation of the ball and up-down knock of the printing head; through a paper-conveying mechanism controlling motion of the printing materials such as paper, preset electronic patterns can be made. The full-automatic electronic printing unit and method has the advantages that the problems that the manufacturing process of the traditional electronic device is complex, consumption of materials and energy sources is high and environmental pollution is high are solved and the increasing needs of the personal electronic design and printing field are met at low cost.

Description

technical field [0001] The invention relates to the technical field of direct printing of circuits and electronic devices, in particular to a fully automatic electronic printing device and printing method based on ball transfer printing electronic ink. Background technique [0002] Traditional integrated circuit (IC) manufacturing is mainly concentrated in large enterprises with superior conditions. With the help of specific high-end electronic processing equipment (such as molecular beam epitaxy technology, etc.) and ultra-clean rooms, the transistors, diodes, resistors, and capacitors required by electronic circuits Electronic components such as inductors and inductors and the connecting wires between them are all integrated on a small piece of silicon chip, and then soldered and packaged in an electronic device in a tube to form a terminal product. The corresponding manufacturing process of this method generally includes: oxidation , lithography, diffusion, epitaxy, sputt...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B41J2/225B41J3/407B41J29/38
Inventor 刘静郑义
Owner TECHNICAL INST OF PHYSICS & CHEMISTRY - CHINESE ACAD OF SCI
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