Propenyl phenoxy compounds with three-branch aromatic structure and preparation method thereof, and bismaleimide resin modified by propenyl phenoxy compounds

A technology of bismaleimide resin and propylene phenoxy, which is applied to the preparation of carbon-based compounds, the preparation of organic compounds, chemical instruments and methods, etc., can solve the problems of poor thermal aging, high curing temperature and post-curing temperature problem, achieve the effect of small mass loss, reduce curing reaction temperature and time, and increase crosslinking density
CN104628544AActive Publication Date: 2015-05-20INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI
Publication Date
2015-05-20

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Abstract

The invention provides propenyl phenoxy compounds with a three-branch aromatic structure and a preparation method thereof, and a bismaleimide resin modified by the propenyl phenoxy compounds, relating to the field of thermosetting resins and adhesives for high-temperature-resistant composite materials. The invention aims to solve the problems of higher curing temperature and higher after-treatment temperature in the existing bismaleimide resin and the problem of poor long-time thermal aging resistance of the cured resin at high temperature. The structural general formula is disclosed in the specification. The preparation method comprises the following steps: adding trifunctional fluoro ketone, allyl phenol and a catalyst into a solvent, heating to react under reflux, filtering, cooling, precipitating, washing with water and baking. The bismaleimide resin modified by the propenyl phenoxy compounds is prepared from bismaleimide, propenyl phenoxy compounds with three-branch aromatic structure, and diallylphenyl compounds. The invention mainly discloses a propenyl phenoxy compounds with three-branch aromatic structure and a preparation method thereof, and a bismaleimide resin modified by the propenyl phenoxy compounds.
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Description

technical field

[0001] The invention relates to the field of thermosetting resins and adhesives for high temperature resistant composite materials. Background technique

[0002] Thermosetting resins are widely used in aerospace, electronics and electrical fields. Bismaleimide (BMI) is a typical representative of high-performance thermosetting resins. As a matrix resin, it plays an important role in the fields of composite materials and structural adhesives. It has the advantages of good mechanical properties, heat resistance, heat and humidity resistance, solvent resistance, etc., and its service temperature can reach as high as 232°C. Therefore, bismaleimide has become the main bearing force of aerospace above the service temperature of epoxy resin The material is resin.

[0003] However, bis-horse resin is generally polymerized by diallyl bisphenol A and N,N'-4,4'-diphenylmethane bismaleimide, and the usual curing temperature is above 200°C, which is due to its curing Th...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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