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Radiator for CPU

A heat sink and consistent technology, applied in the field of heat transfer, can solve the problems that the thermal conductivity of aluminum is not as good as that of copper, the product processing is not easy, and the heat dissipation efficiency is affected, etc., to achieve fast heat conduction, broad market application value, and obvious competitive advantages Effect

Inactive Publication Date: 2015-06-03
陈伟峰
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the limitation of the profile structure, the heat dissipation efficiency of the aluminum fin air-cooled radiator is affected to a certain extent. The thermal conductivity of the aluminum material is relatively inferior to that of the copper material, and the processing from the profile to the product is relatively fast. save trouble

Method used

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  • Radiator for CPU

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Embodiment Construction

[0007] The present invention will be further described below in conjunction with accompanying drawing.

[0008] Such as figure 1 As shown, the heat conduction plate (1) is a square copper plate, and the heat conduction plate (1) is provided with foam copper (2), and the foam copper (2) is a square porous copper foam metal material, and the plane size of the foam copper (2) The size of the square is the same as that of the heat conduction plate (1); the heat conduction plate (1) and the foamed copper (2) are integrated by welding.

[0009] The working principle of the present invention: when the radiator of the present invention is used for CPU, in order to reduce the thermal resistance, apply an appropriate amount of heat-conducting silicon grease on the contact surface of the heat conducting plate (1) and the CPU, and directly place the central position of the bottom surface of the radiator On the CPU, the radiator and the CPU are fixed with clips, the heat on the surface of...

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Abstract

The invention provides a radiator for a CPU. The radiator for the CPU comprises a heat conducting plate (1) and foamed aluminum (2) and is characterized in that the foamed aluminum (2) is a cubic porous foamed aluminum metal material. The radiator for the CPU is low in material density, large in specific surface area, high in porosity, good in air permeability, good in heat dissipation capacity, high in heat dissipation efficiency, light in weight, simple in structure and easy to manufacture.

Description

technical field [0001] The invention relates to the field of heat transfer, in particular to a radiator for CPU. Background technique [0002] Common CPU radiators on the market include water-cooled radiators, heat pipe radiators and aluminum-fin air-cooled radiators. Water-cooled radiators and heat pipe radiators are two types of radiators with better effects among CPU radiators. However, water-cooled radiators are bulky, have a large support system, and are troublesome to install. If there is water leakage, it will threaten the life of the computer system. Relatively speaking, the price is not low. The heat pipe radiator is a radiator with high heat dissipation efficiency, and has a good cooling effect, but its strict manufacturing process determines that it cannot achieve low cost and is expensive, which is a burden for low-end and low-end mass users. Aluminum fin air-cooled radiator is a kind of popular radiator, and it has no problem to cope with the overclocking of p...

Claims

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Application Information

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IPC IPC(8): G06F1/20
CPCG06F1/20
Inventor 陈伟峰
Owner 陈伟峰