Radiator for CPU
A heat sink and consistent technology, applied in the field of heat transfer, can solve the problems that the thermal conductivity of aluminum is not as good as that of copper, the product processing is not easy, and the heat dissipation efficiency is affected, etc., to achieve fast heat conduction, broad market application value, and obvious competitive advantages Effect
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[0007] The present invention will be further described below in conjunction with accompanying drawing.
[0008] Such as figure 1 As shown, the heat conduction plate (1) is a square copper plate, and the heat conduction plate (1) is provided with foam copper (2), and the foam copper (2) is a square porous copper foam metal material, and the plane size of the foam copper (2) The size of the square is the same as that of the heat conduction plate (1); the heat conduction plate (1) and the foamed copper (2) are integrated by welding.
[0009] The working principle of the present invention: when the radiator of the present invention is used for CPU, in order to reduce the thermal resistance, apply an appropriate amount of heat-conducting silicon grease on the contact surface of the heat conducting plate (1) and the CPU, and directly place the central position of the bottom surface of the radiator On the CPU, the radiator and the CPU are fixed with clips, the heat on the surface of...
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