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Atomizing chamber cooling circulation system and method adopting system to cool atomizing chamber

A circulation system and atomization chamber technology, applied in applications, household appliances, household refrigeration devices, etc., can solve the problems affecting the mechanical properties of ingot forming and the solidification speed of mist-like tiny particles, and achieve the effect of increasing the cooling speed

Active Publication Date: 2015-05-13
天津佐源新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The object of the present invention is to provide a cooling circulation system for the atomization chamber and a method for cooling the atomization chamber using the system. The solidification speed finally affects the mechanical properties of the ingot when it is formed, so as to overcome the above-mentioned deficiencies in the prior art

Method used

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  • Atomizing chamber cooling circulation system and method adopting system to cool atomizing chamber
  • Atomizing chamber cooling circulation system and method adopting system to cool atomizing chamber

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Embodiment 1

[0037] like Figure 1-4 As shown, an atomization chamber cooling cycle system includes a heat-absorbing structure 19, a cooling device, a circulating power pump, a heat-conducting medium, and a heat-conducting medium delivery pipeline, and the heat-conducting medium delivery pipeline is sequentially connected to the heat-absorbing structure 19, The cooling device and the circulating power pump together form a heat conducting circuit, and the heat conducting medium circulates in the heat conducting circuit under the action of the circulating power pump; the heat absorbing structure 19 is located in the chamber of the atomizing chamber, To absorb the heat in the atomizing chamber, the heat-absorbing structure 19 has a heat-absorbing chamber for the heat-conducting medium to pass through; temperature.

[0038] It should be noted that the heat transfer medium is water, and the cooling device is a cooling tower 15 .

[0039] This embodiment also includes a heat transfer medium st...

Embodiment 2

[0049] The heat-absorbing structure 19 in this embodiment is different from the heat-absorbing structure 19 in Embodiment 1. The heat-absorbing structure 19 in this embodiment includes an inner cylinder and an outer cylinder, and the outer cylinder is formed by setting the inner cylinder cover inside. The heat-absorbing chamber, the shape of the inner cylinder and the shape of the outer cylinder are all symmetrical about the axis of the vertical direction, and the central axis of symmetry of the inner cylinder coincides with the central axis of symmetry of the outer cylinder . The side wall forming the inner cylinder has a corrugated structure directed towards the central axis of symmetry of the inner cylinder.

Embodiment 3

[0051] In this embodiment, compared with the first embodiment, the atomization chamber cooling cycle system further includes an automatic control device, and the automatic control device includes: a temperature sensor, a water level sensor, a flow regulating valve and a control unit. The temperature sensor includes a first temperature sensor, a second temperature sensor, a third temperature sensor and a fourth temperature sensor, and the first temperature sensor is installed at the heat transfer medium inlet to detect the temperature of the heat transfer medium entering the heat absorption chamber , the second temperature sensor is installed at the outlet of the heat-conducting medium to detect the temperature of the heat-conducting medium flowing out of the heat-absorbing chamber, and the third temperature sensor is installed in the chamber of the atomizing chamber to detect the temperature of the heat-conducting medium flowing out of the heat-absorbing chamber Temperature, th...

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Abstract

The invention discloses an atomizing chamber cooling circulation system and a method adopting the system to cool an atomizing chamber. The system comprises a heat absorbing structure, a cooling device, a circulating power pump, a heat conducting medium and a heat conducting medium delivery pipe, wherein the heat conducting medium delivery pipe is sequentially connected with the heat absorbing structure, the cooling device and the circulating power pump to form a heat conducting loop, and the heat conducting medium circularly flows in the heat conducting loop under the effect of the circulating power pump. The heat absorbing structure is located in a chamber body of the atomizing chamber and used for absorbing heat in the atomizing chamber and is provided with a heat absorbing cavity for the heat conducting medium to pass through. The cooling device is located outside the atomizing chamber and used for reducing the improved temperature of the heat conducting medium absorbing heat of the atomizing chamber. The atomizing chamber cooling circulation system has the advantages that the temperature reducing speed in the atomizing chamber is improved in the spray forming process to obtain ingot blanks with mechanical performance meeting the requirement.

Description

technical field [0001] The invention relates to the field of spray forming of metal material ingot blanks, in particular to an atomization chamber cooling cycle system and a method for cooling the atomization chamber by using the system. Background technique [0002] The ingot spray forming technology is an advanced technology that makes the liquid metal alloy form solid, semi-solid, liquid mist micro-particles deposited on the receiver to form an ingot under the action of inert gas. [0003] The atomization chamber structure of the ingot spray forming in the prior art is as follows: figure 1 As shown, it includes a leak bag, a metal liquid column, an atomizer, an air inlet, an ingot, a tray, a rotating shaft, a moving shaft, an air outlet, and an atomizing box. During work, the inert gas for atomizing the metal is sprayed into the atomization chamber through the atomizer through the air inlet. The liquid column is atomized into tiny solid, semi-solid or liquid fine metal ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F3/115F25D1/02
Inventor 李珮豪冯永信李海军
Owner 天津佐源新材料科技有限公司
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