Organic light emission diode and preparation method thereof
An electroluminescent device and luminescent technology, which is applied in the direction of electric solid-state devices, semiconductor/solid-state device manufacturing, electrical components, etc., can solve the problems of high difficulty, low light extraction efficiency, and high production cost, so as to reduce reflection and improve luminescence Brightness and luminous efficiency, the effect of increasing the light output rate
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Embodiment 1
[0053] The structure of the organic electroluminescent device of this embodiment is: PET substrate / NdF 3 / Ag / MoO 3 / NPB / Ir(MDQ) 2 (acac): NPB (10:100) / Bphen / Al.
[0054] The preparation method of the organic electroluminescent device 100 of this embodiment comprises the following steps:
[0055] Provide a PET substrate 110 with a thickness of 0.1 mm, which is washed and dried for later use;
[0056] In a vacuum of 1×10 -5 In the vacuum coating system of Pa, the anode layer is prepared by thermal resistance evaporation on the surface of the substrate 110. First, thermal resistance evaporation is used to prepare NdF 3 Layer 120 with a thickness of 60nm, then thermal resistance evaporation to prepare a metal Ag layer 130 with a thickness of 18nm, and finally thermal resistance evaporation to prepare MoO 3 Layer 140 with a thickness of 5nm and an evaporation rate of 0.1nm / s;
[0057] Preparation of organic electroluminescence unit 150: in a vacuum of 1×10 -5 In the vacuum c...
Embodiment 2
[0061] The structure of the organic electroluminescent device of this embodiment is: PES substrate / CeF 3 / Au / ReO 3 / MeO-TPD / DCJTB:Alq 3 (5:100) / TPBi / Ag.
[0062] The preparation method of the organic electroluminescent device 100 of this embodiment comprises the following steps:
[0063] Provide a PES substrate 110 with a thickness of 0.5mm, wash and dry for later use;
[0064] In a vacuum of 1×10 -3 In the vacuum coating system of Pa, the anode layer is prepared by thermal resistance evaporation on the surface of the substrate, and the thermal resistance evaporation is first prepared to prepare CeF 3 Layer 120 with a thickness of 100nm, then thermal resistance evaporation to prepare metal Au layer 130 with a thickness of 30nm, and finally thermal resistance evaporation to prepare ReO 3 Layer 140 with a thickness of 10nm and an evaporation rate of 1nm / s;
[0065] Preparation of organic electroluminescence unit 150: in a vacuum of 1×10 -3 In the vacuum coating system of ...
Embodiment 3
[0069] The structure of the organic electroluminescent device of this embodiment is: PI substrate / SiO / Al / V 2 o 5 / TPD / FIrpic:CBP (15:100) / BCP / Ag.
[0070] The preparation method of the organic electroluminescent device 100 of this embodiment comprises the following steps:
[0071] Provide a PI substrate 110 with a thickness of 0.2mm, wash and dry for later use;
[0072] In a vacuum of 1×10 -4 In the vacuum coating system of Pa, the anode layer is prepared by thermal resistance evaporation on the surface of the substrate. First, the SiO layer 120 is prepared by thermal resistance evaporation with a thickness of 80nm, and then the metal Al layer 130 is prepared by thermal resistance evaporation with a thickness of 20nm. Finally, the thermal resistance evaporation is prepared. V 2 o 5 Layer 140 with a thickness of 8nm and an evaporation rate of 0.5nm / s;
[0073] Preparation of organic electroluminescence unit 150: in a vacuum of 1×10 -4 In the vacuum coating system of Pa, ...
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Abstract
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