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Method for manufacturing low-temperature co-fired ceramic substrate green tape of photolithographic film technology printed circuit

A technology of low-temperature co-fired ceramics and production methods, which is applied in the fields of printed circuit manufacturing, printed circuits, printed circuit components, etc., can solve problems such as electronic product damage, process yield reduction, and cutting blade damage, and achieve the goal of reducing damage The effect of increasing production rate, improving production yield, and reducing frictional stress

Inactive Publication Date: 2015-06-03
SHENZHEN WINNGLE TRADE
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Problems solved by technology

[0005] However, low-temperature co-fired ceramic substrates have characteristics such as high hardness and brittleness, so that when a cutting machine cuts a hard substrate, a large friction force will be generated between the substrate and the cutting blade, and the stress generated by this friction will be transferred to the Cutting blades, causing damage to electronic products or cutting blades, resulting in lower process yield

Method used

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  • Method for manufacturing low-temperature co-fired ceramic substrate green tape of photolithographic film technology printed circuit
  • Method for manufacturing low-temperature co-fired ceramic substrate green tape of photolithographic film technology printed circuit
  • Method for manufacturing low-temperature co-fired ceramic substrate green tape of photolithographic film technology printed circuit

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Embodiment Construction

[0031] The low temperature co-fired ceramic substrate, its manufacturing method and semiconductor packaging device according to preferred embodiments of the present invention will be described below with reference to relevant figures.

[0032] Please refer to figure 1 As shown, a low temperature co-fired ceramic substrate 1 according to a preferred embodiment of the present invention includes a plurality of substrate units II and at least one cutting pattern 12 . In this embodiment, four substrate units 11 are taken as an example, but it is not used to limit the number of substrate units II. Users can increase or decrease the number of substrate units I1 according to their needs.

[0033] The cutting pattern 12 is disposed between two adjacent substrate units 11, so that the cutting device can perform cutting action along the cutting pattern 12. Wherein, cutting pattern 12 can be as figure 1 As shown, it is a groove 121, or as figure 2 As shown, it is a multi-hole 122,...

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Abstract

The invention discloses a method for manufacturing a low-temperature co-fired ceramic substrate green tape of a photolithographic film technology printed circuit. A low-temperature co-fired ceramic substrate comprises a plurality of substrate units and one or more cutting patterns, wherein one cutting pattern is arranged between each two adjacent substrate units. The invention further discloses a manufacturing method of the low-temperature co-fired ceramic substrate as well as a semiconductor packaging device. Through arrangement of the cutting patterns on the low-temperature co-fired ceramic substrate, when cutting equipment cuts the low-temperature co-fired ceramic substrate, relatively small friction stress is generated so as to reduce the damage probability of the ceramic substrate, therefore, the production yield is increased and further the cost is reduced.

Description

technical field [0001] The invention relates to a low-temperature co-fired ceramic substrate production for photolithographic film technology printed circuit [0002] Tape manufacturing method, manufacturing method thereof, and semiconductor packaging device. Background technique [0003] With the advancement of technology, current electronic products are oriented toward miniaturization and thinning. Take mobile phones in the wireless communication industry as an example. In just a few years, the size of mobile phones has shrunk from the earliest Black King Kong to less than the size of a palm. At the same time, the function of the mobile phone has developed from the simplest voice transmission to the ability to transmit data and text. It can be seen that light, thin, short, and small are the focus and trend of current design of electronic products, and low-temperature co-fired ceramic (LTCC) technology can meet this demand. [0004] Low temperature co-fired ceramic tech...

Claims

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Application Information

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IPC IPC(8): H05K1/02H05K3/00
Inventor 肖可
Owner SHENZHEN WINNGLE TRADE
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