Machining device and method capable of realizing zero taper and reverse taper drilling

A processing device and inverted cone technology, applied in metal processing equipment, manufacturing tools, welding equipment, etc., can solve problems such as inconvenient integration and complicated processing process

Active Publication Date: 2015-06-10
INNO LASER TECH CORP LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] The purpose of the present invention is to provide a laser processing device capable of realizing zero-taper and reverse-taper grooves, which is used to solve the problems of inconvenient integration and complicated processing process of zero-taper laser processing devices in the prior art

Method used

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  • Machining device and method capable of realizing zero taper and reverse taper drilling
  • Machining device and method capable of realizing zero taper and reverse taper drilling
  • Machining device and method capable of realizing zero taper and reverse taper drilling

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Embodiment Construction

[0033] The present invention will be further elaborated below with reference to the accompanying drawings.

[0034] see figure 1 To attach Figure 5 , a processing device that can realize zero-taper and reverse-taper drilling in the present invention has a laser emitting device, which includes: a dynamic adjustable lens 1; a focusing lens 3; a first wedge-shaped optical glass substrate 41; a second wedge-shaped optical glass substrate 42; wherein, the laser acts on the workpiece to be processed through the dynamically adjustable lens 1, the focusing lens 3, the first wedge-shaped optical glass substrate 41 and the second wedge-shaped optical glass substrate 42, and , the first wedge-shaped optical glass substrate 41 and the second wedge-shaped optical glass substrate 42 are controlled to rotate the device, so as to change the laser irradiation line, thereby realizing the drilling process.

[0035] Please refer to the attached figure 1 , with figure 1 It is a structural sch...

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Abstract

The invention discloses a machining device capable of realizing zero taper and reverse taper drilling. The device sequentially comprises a dynamically adjustable lens, a planar mirror or a galvanometer, a focusing lens, a first wedge-shaped optical glass substrate and a second wedge-shaped optical glass substrate along a the laser irradiation path, wherein a laser sequentially passes through the dynamically adjustable lens, the focusing lens, the first wedge-shaped optical glass substrate and the second wedge-shaped optical glass substrate to act on a to-be-machined part; besides, the first wedge-shaped optical glass substrate and the second wedge-shaped optical glass substrate are controlled by rotating devices, so that the laser irradiation path is changed, and drilling is realized. Dynamic zooming can be realized by the aid of the dynamically adjustable lens, and the laser is prevented from deviating from the focus when deflecting and moving on the surface. The machining device is simple in modular structure, capable of being integrated with a conventional laser machining system, easy to manufacture and low in cost, the laser path is easy to adjust, and zero taper and reverse taper drilling can be realized quickly.

Description

technical field [0001] The invention relates to the technical field of laser processing devices, in particular to a processing device and method capable of realizing zero-taper and reverse-taper drilling. Background technique [0002] The basic principle of laser processing is to focus the laser on the surface of the material, make the interaction between the laser and the material, the Gaussian distribution of the laser beam and the mechanism of the interaction between the laser and the object. After the laser interacts with the material, a positive conical laser drilling hole is formed on the object. . [0003] In the prior art, Gaussian beam processing is used, and in order to realize zero-taper or inverted-taper groove processing, the laser beam should be obliquely incident on the sample surface. There are two basic approaches: one is to tilt the sample, and the other is to tilt the laser beam. Tilting the sample will bring great inconvenience to the processing. There...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/064B23K26/382B23K26/384
Inventor 赵晓杰张杰陶沙
Owner INNO LASER TECH CORP LTD
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