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Method for slicing wafers from a workpiece by means of a wire saw

A technology for workpieces and wire saws, which is applied in the field of cutting wafers from workpieces with the help of wire saws, and can solve problems such as measurement errors

Active Publication Date: 2015-06-10
SILTRONIC AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the detection system can be affected by both the abrasive media and the material removed as a result of the sawing process so that measurement errors occur

Method used

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  • Method for slicing wafers from a workpiece by means of a wire saw
  • Method for slicing wafers from a workpiece by means of a wire saw
  • Method for slicing wafers from a workpiece by means of a wire saw

Examples

Experimental program
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Embodiment Construction

[0038] figure 1 The basic structure of a wire web of a wire saw is shown, comprising two wire rolls (1) with sawing wires (2) extending in parallel. The wire roll (1) has grooves (not shown) for guiding the sawing wire (2). They are mounted rotatably about a longitudinal axis (3) and fixed to the machine frame of the wire saw by means of at least one fixed bearing.

[0039] The core (1a) of the conductor roll (1) preferably consists of steel, aluminum or a composite material such as glass fiber or carbon fiber reinforced plastic. In the method according to the invention, the core (1a) comprises two separate cavities in the form of chambers and / or channels, which are adapted to receive a temperature-regulating medium.

[0040] The sheath (1b) enclosing the lateral surface of the core (1a) of the conductor roll (1) preferably consists of polyurethane (PU) or polyester-based or polyether-based polyurethane, for example as described in DE 10 2007 019 566 B4 public.

[0041] Ac...

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PUM

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Abstract

A method for sawing a multiplicity of wafers from a workpiece by means of a wire web of a wire saw includes providing a wire web consisting of a plurality of parallel wire sections. The wire web is spanned by at least two wire guide rollers where each wire guide rollers comprises a core having two side surfaces and a lateral surface. The core is composed of a first material. Each core is rotatably mounted along its longitudinal axis and comprises at least two separate cavities. The lateral surface of each core is enclosed by a jacket composed of a second material. Parallel groves are cut into the jacket for guiding the wire sections of the web. The length of the jacket is altered thermally by means of at least one cavity being filled with a temperature regulating medium.

Description

technical field [0001] The present invention relates to a method of sawing a number of wafers from a workpiece by means of a wire web of a wire saw, said wire web consisting of a number of wire segments, by means of targeted expansion of the sheath of a wire roll across the wire web (targeted) to improve the geometry and waviness of the cut wafer. Background technique [0002] For electronics, microelectronics and microelectromechanical technology, wafers made of semiconductor material (semiconductor wafers) are required as starting materials with extremely high requirements on overall and local flatness (nanotopography). [0003] Wafers made of semiconductor material are usually silicon wafers or substrates with a layer structure derived from silicon, for example silicon germanium (SiGe), silicon carbide (SiC) or gallium nitride (GaN). [0004] According to the prior art, semiconductor wafers are produced in a number of successive processing steps, in which, for example, i...

Claims

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Application Information

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IPC IPC(8): B28D5/04
CPCB28D5/0058B28D5/045B23D55/08H01L21/30H01L21/3003H01L21/30625H01L21/6836
Inventor P·威斯纳R·克鲁泽德
Owner SILTRONIC AG