Epoxy resin curing agent, epoxy resin composition, hardened material thereof, and optical semiconductor device

An epoxy resin curing and epoxy resin technology, which is used in semiconductor devices, semiconductor/solid-state device parts, electric solid-state devices, etc., to achieve the effects of less coloring, good strength, and easy handling

Active Publication Date: 2015-06-10
RESONAC CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] However, in general, polyester resin tends to be colored when condensed, so in the invention described in the above-mentioned Patent Document 4, as shown in the Examples, the cured product is remarkably colored from yellow to brown.
Therefore, there is a practical problem in applications requiring colorless and transparent properties such as the above-mentioned LED sealing material.

Method used

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  • Epoxy resin curing agent, epoxy resin composition, hardened material thereof, and optical semiconductor device
  • Epoxy resin curing agent, epoxy resin composition, hardened material thereof, and optical semiconductor device
  • Epoxy resin curing agent, epoxy resin composition, hardened material thereof, and optical semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0070] 20 parts by weight of polyester dendrimer (hydroxyl value 470 mgKOH / g, weight average molecular weight 1800, viscosity 7.6 Pa·s (25°C), BOLTORN P-1000: Perstorp trade name) Specifically, 116 parts by weight of 4-methylhexahydrophthalic anhydride (HN-7000: manufactured by Hitachi Chemical Industry Co., Ltd. / anhydride equivalent 168 (g / eq)) was added as a polycarboxylic acid anhydride, heated to 70° C. Stir and dissolve until it becomes uniform, thereby obtaining the epoxy resin curing agent (I).

[0071] With respect to 136 parts by weight of epoxy resin curing agent (I), add 3',4'-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate (CELLOXIDE 2021P : DAICEL CHEMICAL INDUSTRIES, LTD. (DAICEL CHEMICAL INDUSTRIES, LTD.) product name / epoxy equivalent 138 (g / eq)) 100 parts by weight, tetra-n-butylphosphonium o, o-diethyl diethyl diethyl disulfide as a curing accelerator 1 part by weight of phosphodisulfate (Hishikorin (ヒシコーリン) PX-4ET: trade name manufactured by Nippon C...

Embodiment 2

[0074] An epoxy resin curing agent (II) was obtained in the same manner as in Example 1, except that 40 parts by weight of polyester dendrimers were used instead of 20 parts by weight of polyester dendrimers.

[0075] Except having used 156 weight part of epoxy resin curing agents (II) instead of epoxy resin curing agent (I), it carried out similarly to Example 1, and obtained the epoxy resin composition (II). Furthermore, it carried out similarly to Example 1, and obtained the hardened|cured material (II).

Embodiment 3

[0077] Except for the use of a mixture of 3-methylhexahydrophthalic anhydride and 4-methylhexahydrophthalic anhydride (hereinafter referred to as 3&4-methylhexahydrophthalic anhydride. HN-5500E: Hitachi Chemical An epoxy resin curing agent (III) was obtained in the same manner as in Example 1 except that Kogyo Co., Ltd. / acid anhydride equivalent weight 168 (g / eq)) was used as polyvalent carboxylic acid anhydride 116 parts by weight.

[0078] From the epoxy resin curing agent (III), it carried out similarly to Example 1, and obtained the epoxy resin composition (III). Furthermore, it carried out similarly to Example 1, and obtained the hardened|cured material (III).

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Abstract

Disclosed is an epoxy resin hardening agent that contains a multivalent carboxylic acid anhydride and a dendritic polymer with a hydroxy value of 550 mg KOH / g or less, with the aforementioned dendritic molecule preferably having a weight-average molecular weight of 2000 or less. Thus, an epoxy resin composition with low viscosity and good handling can be obtained, and a hardened material with little discoloration, excellent crack resistance, and excellent transparency can be obtained.

Description

[0001] The present invention is the application number 2009801299408 (international application number is PCT / JP2009 / 063188), the application date is July 23, 2009, and the invention name is "epoxy resin curing agent, epoxy resin composition, its cured product and optical A divisional application of the invention application for "semiconductor device". technical field [0002] The present invention relates to an epoxy resin curing agent, an epoxy resin composition, its cured product, and an optical semiconductor device. More specifically, it relates to an epoxy resin curing agent, an epoxy resin composition, a cured product thereof, and an optical semiconductor device for forming a cured product with less coloring and excellent crack resistance and transparency. Background technique [0003] In general, cured epoxy resins obtained from acid anhydrides and epoxy resins are cheap and have excellent transparency, electrical insulation, chemical resistance, moisture resistance, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/42C08L63/00H01L23/29
CPCC08G59/4246C08L63/00H01L23/293H01L2924/0002H01L2924/00
Inventor 椎名大铃木实
Owner RESONAC CORPORATION
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