Pico-second laser combined machining SLM device and laser rapid prototyping methods

A technology of laser rapid prototyping and composite processing, which is applied in the direction of additive processing, process efficiency improvement, and energy efficiency improvement. Reduce Workflow Effects
CN104708003AActive Publication Date: 2015-06-17XIAN BRIGHT ADDTIVE TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
XIAN BRIGHT ADDTIVE TECH CO LTD
Publication Date
2015-06-17

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Abstract

The invention discloses a pico-second laser combined machining SLM device. The pico-second laser combined machining SLM device comprises a bearing platform used for placing components and parts, a sealing cabin is arranged on the bearing platform, a galvanometer unit is arranged on the upper portion of the sealing cabin, and the galvanometer unit is connected with a pico-second laser and an ordinary laser through a laser beam processing unit. The invention further provides two laser rapid prototyping methods using the pico-second laser combined machining SLM device. The laser rapid prototyping methods comprise the steps that a three-diamensional model of a part is subjected to hierarchical slicing, and a two-dimensional model of each layer is subjected to main body sintering first and then contour sintering. The problems that the working process of a SLM device in the prior art is complex, the precision of the surface treatment of the part is not high, so that the later additional handling work of the part is tedious, and the labor is consumed are solved.
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Description

technical field

[0001] The invention belongs to the technical field of laser rapid prototyping, and in particular relates to a picosecond laser compound processing SLM equipment, and the invention also relates to a laser rapid prototyping method. Background technique

[0002] Selective laser melting SLM is a method of laser stereoforming and the latest technical means of rapid prototyping technology. SLM equipment is laser rapid prototyping equipment. However, the selective laser melting SLM equipment at this stage is processed and sintered by a single laser, and the formed parts need to be processed again to make the surface smooth, and the whole working process is complicated, and the precision of the surface treatment of the parts is not high, which makes the parts later The surface treatment work is also cumbersome, labor-intensive and time-consuming. Contents of the invention

[0003] The purpose of the present invention is to provide a picosecond laser compound proc...

Claims

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