A beam-groove combined stepped island membrane micro-pressure sensor chip and its preparation method
A micro-pressure sensor, step-type technology, applied in the direction of fluid pressure measurement by changing the ohmic resistance, can solve the problems of not meeting the measurement requirements in the aerospace field, staying, and not being able to adapt, so as to achieve mass production, facilitate processing, well-structured effects
Active Publication Date: 2017-03-29
XI AN JIAOTONG UNIV
View PDF7 Cites 3 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0005] my country's current MEMS micro-pressure sensors are still mainly at the kPa level, which cannot meet the requirements of Pa-level micro-pressure measurement in the aerospace field, nor can it adapt to such as the precise measurement technology of deep and high-altitude micro-pressure, and the precise micro-pressure measurement in biomedical equipment. needs in other fields
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0040] The present invention will be described in detail below in conjunction with the accompanying drawings.
[0041] A beam-groove combined with a step-type island membrane micro-pressure sensor chip, including a thin film 2 arranged in the middle of a substrate 1, referring to Fig. 1(a), Fig. 1(b), Fig. 1(c), figure 2 , the four shallow grooves 3-1, 3-2, 3-3, 3-4 are evenly distributed along the upper edge of the film 2, and the depths of the four shallow grooves 3-1, 3-2, 3-3, 3-4 are 2 5% to 90% of the thickness; four embossed beams 4-1, 4-2, 4-3, 4-4 are arranged between the ends of two adjacent shallow grooves and connected to the base 1, and the four embossed beams 4 The height of the upper surface of -1, 4-2, 4-3, 4-4 above the upper surface of the film 2 is 5% to 90% of the thickness of the film 2, and the embossed beams 4-1, 4-2, 4-3, 4 The upper surface of -4, the upper surface of the film 2 and the bottom surfaces of the shallow grooves 3-1, 3-2, 3-3, and 3-4 for...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
| Property | Measurement | Unit |
|---|---|---|
| Sensitivity | aaaaa | aaaaa |
Login to View More
Abstract
A micro-pressure sensor chip with a beam groove combined with a stepped island membrane and its preparation method. The chip includes a film in the middle of a base, four shallow grooves are distributed along the upper edge of the film, and four embossed beams are arranged between the ends of two adjacent shallow grooves. Connected with the base, the upper surface of the embossed beam, the upper surface of the film and the bottom surface of the shallow groove form a beam-groove combined stepped film structure. Four varistor strips are arranged on the four embossed beams, and metal leads connect the varistor strips. It forms a semi-open-loop Wheatstone bridge, and the output end of the bridge is connected to the pad; the four bumps are evenly distributed along the lower edge of the film and connected to the substrate; the four mass blocks are spaced from the bumps, and the bumps are connected to the On the thin film, the preparation method is to oxidize the SOI silicon wafer at high temperature to make varistor strips, obtain the ohmic contact area to make metal leads and pads; then make four relief beams and shallow grooves, and finally bond the back of the substrate with the anti-overload glass. The invention has the characteristics of high sensitivity and good linearity.
Description
technical field [0001] The invention relates to the technical field of MEMS piezoresistive micro-pressure sensors, in particular to a beam-groove combined stepped island membrane micro-pressure sensor chip and a preparation method. Background technique [0002] With the development of micro-mechanical electronic system technology, MEMS micro-pressure sensors have been widely used in wind tunnel testing, biomedical and other fields, especially in the aerospace field, there are strict requirements on the volume and weight of the sensor, and the sensor is required to have certain sensitivity and natural frequency. MEMS sensor is undoubtedly a very ideal choice. For example, in the field of aerospace, it is of great significance to monitor the altitude of the aircraft at high altitude, and the pressure has a certain proportional relationship with the altitude, so the change of the altitude of the aircraft can be reflected by the pressure sensor. The atmospheric pressure change...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Patents(China)
IPC IPC(8): G01L9/06
Inventor 蒋庄德徐廷中赵立波彭年才王久洪郭鑫许煜苑国英赵玉龙
Owner XI AN JIAOTONG UNIV