Circuit board having via and manufacturing method thereof

Abstract

The disclosure provides a manufacturing method for a circuit board having a via and including a substrate, a ground conductor, a floated conductor and a signal conductor. The substrate includes a second sheet layer, a second ground layer, a core layer, a first ground layer and a first sheet layer that are stacked in sequence from bottom to top. The ground conductor penetrates through the core layer and is electrically coupled to the first ground layer and the second ground layer. The floated conductor penetrates through the core layer and is electrically insulated from the first ground layer, the second ground layer and the ground conductor. The signal conductor penetrates through the substrate, being located between the ground conductor and the floated conductor, and insulated from the first ground layer, the second ground layer, the ground conductor and the floated conductor.

Description

technical field [0001] The invention relates to a circuit board with a transmission hole and a manufacturing method thereof, in particular to a circuit board with a transmission hole which improves the impedance of the transmission hole and a manufacturing method thereof. Background technique [0002] In circuit design, when a signal is to be transmitted from one circuit layer to another circuit layer, the transmission holes are usually used to electrically connect the circuits of the two layers. The existing coaxial transmission hole includes a signal conductor, a dielectric material surrounding the signal conductor, and a ground conductor surrounding the dielectric material. [0003] However, due to the limited wiring layout space of the circuit on the substrate, the practicable size of the coaxial transmission hole is quite small. As a result, the impedance of the signal conductor of the coaxial transmission hole will be smaller than the impedance of the circuit transmiss...

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Problems solved by technology

[0003] However, due to the limited wiring layout space of the circuit on the substrate, the practicable size of the coaxial transmission hole is quite small. As a result, the impedance of the signal conductor of the coaxial transmission hole will be smaller than the impedance of the circuit transmission line (the impedance of the circuit transmission line is generally designed for 50 ohms)

Due to the difference in impedance between the circuit transmission line and the signal conductor of the general coaxial transmission hole, when the circuit signal passes through the signal conductor of the transmission hole from the circuit layer, or passes through the circuit layer from the transmission hole, the signal reflection phenomenon will occur, resulting in signal transmission distortion. question

Especially when the signal is a high-speed signal, the occurrence of signal distortion will be more serious

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