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262results about How to "Remove load" patented technology

Impedance control using fuses

A system and method for reducing impedance loading of semiconductor integrated circuit devices implementing protective device structures that contributes to impedance loading at an I/O pad connection. The method comprises providing a fuse device between the I/O pad connection and the protective device; connecting a current source device associated with each fuse device in the integrated circuit, the current source device connected to one end of the fuse device; providing fuse selection circuit for activating current flow through a selected fuse device between the current source and the I/O connection, the current flow being of an amount sufficient for blowing the fuse and disconnecting the protective device from the circuit structure, thereby reducing impedance loading at the I/O connection. Such a system and method is employed in a memory system comprising integrated circuit chips disposed in a stacked relation, with each chip including: a layer of active circuitry formed at a first layer of each chip; a plurality of through conducting structures disposed substantially vertically through each chip for enabling electronic connection with active circuitry at the first layer; second conducting device disposed at an end of the through conducting structure at an opposite side of a chip for connection with a corresponding through conductive structure of an adjacent stacked chip, the stacked chip structure formed by aligning one or more through conducting structures and second conducting devices of adjacent chips, whereby a chip of the stack is electronically connected to active circuitry formed on other chips of the stack. The stacked chip structure is ideal for reducing data access latency in memory systems employing memory chips such as DRAM.
Owner:MARVELL ASIA PTE LTD

Vapor-tight lighting fixture

InactiveUS20120229025A1Readily and individually accessible for service and replacementReadily removableLight source combinationsPoint-like light sourcePenetronLed array
This invention provides a vapor-tight luminaire that maintains a moisture-proof, sealed lower housing for the light-producing lamps (fluorescent lights, LED arrays, etc.) while isolating the electronic components in a separate, upper housing that is spaced apart from, and largely thermally isolated from, the lamps. The lamp housing comprises a unitary non-penetrated tubular lens with one or more removable end caps, sealed by gaskets. The lamp assembly is slidably mounted within the lower housing so that it is readily removable and replaceable with another assembly of the same or different type. The electronics in the upper housing is readily accessible and replaceable by removing a top cover that encloses a three sided channel member. The upper housing is metal and desirably enhances heat exchange with the environment. The two housings are held together by a pair of opposing end cap structures that include a housing end and a removable end cap. The housing end includes an upper plate that is fastened against an adjacent end of the upper housing's channel member. This compresses gaskets that stand between the respective ends of the lens and a lower ring on each housing end. The electronics of the upper housing is interconnected via a wiring harness connector to an end connector in on the lamp assembly. The wiring harness passes between the two housings free of penetration of the lens.
Owner:GREENDOT TECH

Impedance control using fuses

A system and method for reducing impedance loading of semiconductor integrated circuit devices implementing protective device structures that contributes to impedance loading at an I / O pad connection. The method comprises providing a fuse device between the I / O pad connection and the protective device; connecting a current source device associated with each fuse device in the integrated circuit, the current source device connected to one end of the fuse device; providing fuse selection circuit for activating current flow through a selected fuse device between the current source and the I / O connection, the current flow being of an amount sufficient for blowing the fuse and disconnecting the protective device from the circuit structure, thereby reducing impedance loading at the I / O connection. Such a system and method is employed in a memory system comprising integrated circuit chips disposed in a stacked relation, with each chip including: a layer of active circuitry formed at a first layer of each chip; a plurality of through conducting structures disposed substantially vertically through each chip for enabling electronic connection with active circuitry at the first layer; second conducting device disposed at an end of the through conducting structure at an opposite side of a chip for connection with a corresponding through conductive structure of an adjacent stacked chip, the stacked chip structure formed by aligning one or more through conducting structures and second conducting devices of adjacent chips, whereby a chip of the stack is electronically connected to active circuitry formed on other chips of the stack. The stacked chip structure is ideal for reducing data access latency in memory systems employing memory chips such as DRAM.
Owner:MARVELL INT LTD

Method for processing high-concentration wastewater containing alkaline mud

The invention discloses a method for processing wastewater containing alkaline mud with high COD concentration, high toxicity, low biodegradability and high chroma. In the invention, a micro-electrolysis pretreatment, and flocculating and decoloring process are adopted to reduce the COD concentration and chroma and improve the biodegradability, thus providing precondition for the subsequent acidified hydrolysis and aerobic treatment system to further eliminate alkaline mud contamination load; and the yielding water is deposited by a deposition pool and discharged after disinfection. In the invention, the COD concentration (80,000-300,000mg / L) and the chroma (12,500-50,000 times) of inflowing water are improved to maximum degree, stability for the running of system is considered sufficiently, a large amount of diluted water required in the running process is saved, the yielding water can be directly exhausted to urban sewage pipelines, received by waterbody or combined in other treatment systems for treatment, and can comply with the recycling standard. In the whole treatment process, the secondary pollution is not generated, the total emission amount of COD is reduced, the whole system runs conveniently and quickly, and the investment and running expense is far lower than that of the traditional film treatment system.
Owner:TONGJI UNIV +1
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