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Electronic Component Lifecycle Monitoring System

An electronic component and life cycle technology, which is applied in the field of programmable life cycle self-monitoring of electronic components, can solve problems such as the inability to exclude space heat dissipation factors and the inability to monitor the temperature of electronic components printed circuit board level, etc., to achieve the effect of being conducive to failure analysis.

Active Publication Date: 2018-03-30
SHANGHAI BAOSIGHT SOFTWARE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] A typical way of using radio frequency identification technology to collect the environmental temperature data of electronic components remotely and online is to attach an active radio frequency identification tag with temperature sensing function to the outside of the electronic component. The wireless communication of active radio frequency identification tags depends on battery power supply. The shapes and materials of the electronic component shells are different, and there are inevitably difficulties in attaching active radio frequency identification tags, and the space heat dissipation factor cannot be ruled out, and the temperature of the printed circuit board level of the electronic component cannot be monitored.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0059] Electronic component lifecycle self-monitoring system, such as figure 1 shown, including radio frequency identification tags, microprocessors;

[0060] The radio frequency identification tag includes a non-volatile memory, a real-time clock, a radio frequency interface, and an embedded or external temperature sensor;

[0061] The radio frequency interface is used for connecting an external antenna and performing two-way data exchange with the reader;

[0062] The real-time clock is used for timing;

[0063] The temperature sensor is used to detect the temperature of the electronic component;

[0064] The non-volatile memory is used to store time and temperature integration parameter files, lifetime files, and temperature record files;

[0065] The microprocessor is used for the current timing of the real-time clock, the temperature of the electronic component currently detected by the temperature sensor, and the temperature integration parameter data in the time temp...

Embodiment 2

[0068] Based on Embodiment 1, the non-volatile memory, logical partition file system, such as figure 2 As shown, the file system includes: time temperature integration parameter file, lifetime file and temperature record file;

[0069] The time-temperature integration parameter file is a single-record fixed-length file, including a temperature collection granularity field, a temperature collection cycle field, a maximum temperature record item number field, and a life cycle self-monitoring cycle field;

[0070] The lifetime file is a single-record fixed-length file, including a remaining lifetime field and a historical file system modification time field;

[0071] The temperature record file is a multi-record variable-length file, and the maximum number of record items stored in the temperature record file is the maximum number of temperature record items set in the maximum temperature record item number field of the temperature integration parameter file, using first-in firs...

Embodiment 3

[0092] Based on the second embodiment, the antenna is a grounded printed copper sheet with a window on the printed circuit board of the electronic component;

[0093] The radio frequency interface of the radio frequency identification tag is externally connected to the antenna through a three-axis tuning network;

[0094] The three-axis tuning network is used to implement input and output impedance matching;

[0095] The triaxial tuning network, as Figure 5 As shown, including the basic fixed capacitor C, the intermediate tuning capacitor Clen, the input tuning capacitor Cin, and the output tuning capacitor Cout;

[0096] The input tuning capacitor Cin is used to tune the input impedance of the three-axis tuning network close to the output impedance of the previous stage, one end of the input tuning capacitor is grounded, and the other end is connected to the input end of the three-axis tuning network;

[0097]The output tuning capacitor Cout is used to tune the output impe...

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PUM

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Abstract

The invention discloses a life cycle self-monitoring system of an electronic component, which includes a radio frequency identification tag and a microprocessor; the radio frequency identification tag includes a non-volatile memory, a real-time clock, a radio frequency interface, and an embedded or external temperature sensor; It is connected to an external antenna for two-way data exchange with the reader; the non-volatile memory is used to store time and temperature integration parameter files, life cycle files, and temperature record files; Component temperature, as well as the temperature integral parameter data in the time temperature integration parameter file, the life cycle data in the life cycle file, and the temperature record data in the temperature record file, execute the electronic component life cycle self-monitoring calculation, and calculate the electronic component The remaining lifetime is updated to the lifetime file. The invention can carry out temperature and time two-dimensional monitoring on the life cycle of the electronic component, and can carry out accurate failure analysis on the electronic component.

Description

technical field [0001] The invention relates to industrial control technology, in particular to a self-monitoring method for programmable lifetime of electronic components based on dual-interface ultra-high frequency radio frequency identification. Background technique [0002] The application environments of industrial control electronic components vary greatly. When performing failure analysis on complex equipment, knowledge reserve is the most important. Some common issues that need to be understood include correct electronic component models, correct integrated circuit version numbers, and application environment time-temperature curves. It is often the case that an electronic component fails so many times that the source of the damage cannot be identified. Thorough post-mortem testing is futile for accurate failure analysis. An online in-application monitoring method is needed to record what happened at the client end. [0003] The existing electronic component life cyc...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01K13/00G08C17/02G06K7/10G06F17/40
Inventor 周媛闻扬王慧芬杜晓阳
Owner SHANGHAI BAOSIGHT SOFTWARE CO LTD