Low and medium frequency sound insulation meta-material structure prepared by 3D printing

A 3D printing and metamaterial technology, applied in the direction of sensors, electrical components, sensor types, etc., can solve the problems of unsatisfactory fixing methods, affecting the service life of materials, complex processing technology, etc., to achieve light weight, simple structure and simple process. Effect

Inactive Publication Date: 2015-08-12
SHANGHAI JIAO TONG UNIV
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  • Abstract
  • Description
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AI Technical Summary

Problems solved by technology

[0004] The current local resonance sound insulation materials are composed of a variety of materials, the design is difficult, the processing technology is very complicated, and the fixing method between different materials is not ideal, which often affects the service life of the material
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Method used

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  • Low and medium frequency sound insulation meta-material structure prepared by 3D printing
  • Low and medium frequency sound insulation meta-material structure prepared by 3D printing
  • Low and medium frequency sound insulation meta-material structure prepared by 3D printing

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[0025] The present invention will be further described in detail below with reference to the drawings and embodiments, but the protection scope of the present invention should not be limited by this.

[0026] See figure 1 , figure 1 It is a structural schematic diagram of the first embodiment of the unit body of the mid- and low-frequency sound insulation metamaterial structure prepared by 3D printing technology of the present invention. As shown in the figure, a medium and low frequency sound insulation metamaterial prepared by 3D printing technology includes a frame 1 , The unit body formed by the connecting body 2 and the central body 3, and the unit body is composed of a single material. The shape of these three parts can be any shape such as square, circle, triangle. The thickness of the frame 1 and the center body 3 is 2mm-50mm thick, and the thickness of the connecting body 2 is 0.2mm-10mm thinner, and the thickness ratio of the frame 1 and the connecting body 2 is 5 or mo...

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Abstract

The invention discloses a low and medium frequency sound insulation meta-material structure prepared by 3D printing, comprising a unit body, formed by integrating a frame, a connecting body, and a center body. The unit body is composed of single materials. The center body is disposed at the center of the frame, and the connecting body is connected to the frame and the center body, and the thickness of the frame is five times or over five times of that of the connecting body. The low and medium frequency sound insulation meta-material structure prepared by 3D printing is advantageous in that with no counterweight block and no hard base body, the integral density of the meta-material will no exceed 1300kg/m3; use is rapid and convenient, device investment cost is low, process is simple, energy is saved and environment is protected, time consumed is short, and sound isolation of low and medium frequency can be realized.

Description

technical field [0001] The invention belongs to the technical field of medium and low frequency sound insulation metamaterials, and in particular relates to a medium and low frequency sound insulation supermaterial structure which can be prepared by 3D printing technology. Background technique [0002] Acoustic metamaterials refer to a class of man-made materials for acoustics with special properties that do not exist in nature. Specially designed acoustic metamaterials often have special properties that cannot be achieved by traditional materials, such as acoustic imaging and acoustic invisibility. In fact, there is nothing special about the components that make up acoustic metamaterials. Their peculiar properties stem from their specially designed geometric structures and sizes, or the periodicity and specific placement of materials with different properties. Typically, acoustic metamaterials contain various microstructures that can be engineered to exert exotic effects o...

Claims

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Application Information

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IPC IPC(8): H04R17/00H04R31/00
Inventor 钱炜王晓乐安冠南余征跃李龙光黄震宇叶杰明
Owner SHANGHAI JIAO TONG UNIV
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