A cleaning medium collection device

Abstract

The invention provides a cleaning medium collecting device and relates to the technical field of semiconductor wafer processes. The cleaning medium collecting device is used for collecting cleaning media after cleaning during the cleaning process of wafers borne on a rotary body and comprises a cleaning medium collecting structure, an annular cavity, a piezoelectric ceramic ultrasonic atomizing device, an exhaust component, a liquid discharge component and a condensation recovery device. The annular cavity is arranged at the peripheral edge of the rotary body. The high-frequency vibration performance of the piezoelectric ceramic ultrasonic atomizing device is utilized to atomize the liquid cleaning media tossed out during the cleaning process, liquid cleaning medium back splashing is prevented, secondary pollution is avoided, and wafer quality is further increased. Meanwhile, the atomized cleaning media are recycled through the exhaust component and the condensation recovery device, the cleaning media not atomized are recycled through the liquid discharge component, the recycling efficiency of the cleaning media is increased greatly, and cost is saved.

Description

technical field [0001] The invention belongs to the technical field of semiconductor wafer technology, in particular to a cleaning medium collecting device, which collects the cleaned cleaning medium when the wafer is cleaned. Background technique [0002] As the feature size of integrated circuits enters the deep submicron stage, the cleanliness of the wafer surface required in the integrated circuit wafer manufacturing process is becoming more and more stringent. In order to ensure the cleanliness of the surface of the wafer material, the manufacturing process of the integrated circuit There are hundreds of cleaning processes in the manufacturing process, and the cleaning process accounts for 30% of the entire manufacturing process. [0003] In the cleaning process, with the improvement of the cleaning process, the cleaning equipment has also developed from the initial tank cleaning to the more complex and higher-precision single-chip cleaning. In the process of single-wa...

AI Technical Summary

Problems solved by technology

[0004] However, in this process, due to the high kinetic energy of the liquid particles thrown out at high speed, when they hit the side wall of the liquid collection structure, they may rebound, causing chemical reagents and cleaning products to splash back to the wafer. edge, or even the backside of the wafer, causing contamination

If this pollution cannot be removed in time, it will cause defects on the back and edge of the wafer, especially in the subsequent high-temperature treatment process, the pollutants on the back and edge will diffuse to the front, seriously affecting the quality of the wafer

In addition, the splash back of the liquid cleaning medium will also cause waste of liquid medicine and increase production costs

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