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Thermally conductive flexible adhesive material for aerospace applications

An adhesive, thermal conductivity technology, applied in the direction of adhesive, application, adhesive type, etc., can solve problems such as high thermal conductivity values

Active Publication Date: 2015-08-26
THE BOEING CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Additionally, these other measurement techniques are not performed in a vacuum, resulting in artificially high thermal conductivity values ​​caused by the additional heat loss through the air

Method used

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  • Thermally conductive flexible adhesive material for aerospace applications
  • Thermally conductive flexible adhesive material for aerospace applications
  • Thermally conductive flexible adhesive material for aerospace applications

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[0067] Figure 2A and 2B A process flow diagram corresponding to a method 200 of forming a thermally conductive flexible bond for circuit boards for unmanned spacecraft and other aerospace applications is shown in accordance with some aspects. The thermally conductive flexible bond is formed using a thermally conductive flexible adhesive material, often referred to herein as the adhesive material. In some aspects, a method of preparing a thermally conductive flexible adhesive material and / or components thereof is also part of method 200 . Alternatively, pre-prepared adhesive material may be used in method 200 without upstream operations. For example, a frozen premix can be provided, and method 200 can begin at process 220, where the frozen premix can be brought to an operating temperature.

[0068] Furthermore, it is possible to perform a method of making a thermally conductive flexible adhesive without subsequently using this adhesive by the same entity. For example, trea...

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Abstract

Provided are methods of forming thermally conductive flexible bonds for use in electronic boards of unmanned spacecrafts and other types of aircraft. Also provided are methods of preparing adhesive materials to form these bonds including methods of preparing treated filler particles. In some aspects, an adhesive material includes filler particles having organofunctional groups, such as boron nitride particles treated in silane. These particles may be combined with a urethane modified epoxy to form the adhesive material. The weight ratio of the particles in the adhesive material may be about 40-60%. The adhesive material may be thermally cured using a temperature of less than 110°C to prevent damage to bonded electronic components. The cured adhesive may have a thermal conductivity of at least about 2 W / m K measured in vacuum and may have a glass transition temperature if less than -40°C.

Description

Background technique [0001] Thermal management of electronic components and the circuit boards containing them is essential to the successful operation of various aerospace vehicles, including unmanned spacecraft. The continued miniaturization of electronic components and integration solutions has led to a dramatic increase in heat generation per unit volume. This increased heating limits not only circuit design, such as the layout of electronic components on a circuit board, but also the design of individual electronic components, and can damage the entire circuit due to overheating of components, connections, wires, and other features of the circuit board and individual component reliability. [0002] The heat generated during the operation of these electronic components needs to be transferred to other areas to ensure the continuous operation of these components. Since these boards typically operate in a vacuum environment (such as in an unmanned spacecraft), heat may be ...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J11/04C09J5/00
CPCC09K5/14H05K2201/0239H05K2203/12C08K3/38H05K3/305C09J11/06H05K1/0203H05K2201/0209H05K2201/0133C09J163/00B32B37/1284B32B37/18B32B2457/00B32B2037/1253C09J5/06C09J9/00C09J2203/326C09J2463/00H05K1/0209C07F7/1804Y02P70/50C08K9/06B29C65/4855B29K2063/00B29K2509/04B29L2031/3406C08K2003/382C09J183/00
Inventor P·芭比洛R·J·莫斯
Owner THE BOEING CO
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