Powder microwave chemical vapor phase coating equipment capable of realizing continuous production

Abstract

The invention discloses powder microwave chemical vapor phase coating equipment capable of realizing continuous production. The microwave chemical vapor phase coating equipment comprises a feeding valve, a reaction chamber and a discharging valve which are sequentially connected, wherein the reaction chamber is a straight tube of which two ends are provided with elbows; a rotary driving device and a plurality of magnetrons are arranged on the straight tube; an air inlet I and a reaction chamber exhaust outlet are correspondingly formed in two ends of the reaction chamber; the feeding valve comprises a casing, a feeding valve rotor inside the casing as well as a feed opening, a feeding valve air inlet, a feeding valve exhaust outlet and a feeding speed-regulating valve which are arranged on the same plane together with the feeding valve rotor; the feeding valve rotor can freely rotate inside the casing and is tangent to the inner wall of the casing to form the sealing; the discharging valve is similar to the feeding valve in structure, and can also realize material transfer by the rotation of the rotor and keeps the sealing property of the reaction chamber; both the feeding valve rotor and a discharging valve rotor are of structures of which one ends are opened. According to the powder microwave chemical vapor phase coating equipment, the continuous production can be realized; in addition, prepared products are provided with uniform coating layers and are homogeneous and stable in property.

Description

technical field [0001] The invention relates to equipment for chemical vapor phase coating of powder, in particular to a microwave chemical vapor phase coating equipment for continuous production of powder. Background technique [0002] Chemical vapor deposition is a process technology in which reacting substances undergo chemical reactions under gaseous conditions to generate solid substances that are deposited on the surface of solid substrates to prepare solid materials. Chemical vapor deposition belongs to the gaseous mass transfer process in the atomic category, and is mainly used to prepare thin film materials. The process is under normal pressure or vacuum conditions, using plasma and laser assisted technology to promote chemical reactions, so that the deposition process can be carried out at a lower temperature. The chemical composition of the coating can be changed with the composition of the gas phase to obtain a gradient deposit or a mixed coating, and the thickn...

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Problems solved by technology

However, chemical vapor deposition is usually used to coat macroscopic workpieces with a small specific surface area. When it is used for microscopic particle modification, since the position where the gas is cracked is far away from the coated surface, there is directionality in the mass transfer process, and the orientation of the film Too strong, uneven coating thickness

General chemical vapor deposition equipment works intermittently, with large batch differences, and cannot achieve high-speed production in large quantities

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