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Charging method for preparing binary submicron metal alloy powder by using physical vapor deposition

A physical vapor deposition and metal alloy powder technology, which is applied in the field of submicron metal alloy powder preparation, can solve the problems of irregular powder shape, failure to achieve alloy structural performance, small scale, etc., and achieve stable metal element content and composition The effect of uniform distribution and large particle size span

Active Publication Date: 2015-09-16
JIANGSU BOQIAN NEW MATERIALS
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

The chemical method prepares submicron or even nanoscale metal alloy powder through a series of chemical reactions according to the active order of the metal, but its scale is small and the shape of the powder is irregular, which is not suitable for large-scale industrial production.
[0004] At present, the physical vapor deposition method is an ideal method for large-scale production of submicron metal powder (for details, please refer to ZL201110119245.2, metal evaporation device and method for preparing ultrafine metal powder with the device), but this method is not suitable for preparing ultra-submicron metal powder. Pure metal powder is ideal, but there are big problems in the production of metal alloy powder
Because in the high-temperature gaseous state, the free energy of metal atoms increases, the chemical bonds are destroyed, single metal atoms are separated, and various metal vapors are presented. During the cooling process, the melting points of different metals are different, and they will be in order according to the melting point. Turning into a single metal liquid and then condensing into a solid, resulting in uneven composition of the metal alloy powder and failing to achieve the proper structural properties of the alloy

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  • Charging method for preparing binary submicron metal alloy powder by using physical vapor deposition
  • Charging method for preparing binary submicron metal alloy powder by using physical vapor deposition
  • Charging method for preparing binary submicron metal alloy powder by using physical vapor deposition

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Embodiment 1

[0035] Embodiment 1, feeding design of binary submicron Cu-20%Mn (ie Cu:Mn=4:1) alloy powder

[0036] The metal is vaporized after being heated to form a metal gas. The vapor pressure of different metal gases is different, which is mainly affected by the temperature. According to the Clausius-Claiplan equation and the modification of practical application, the relationship between saturated vapor pressure and temperature is as follows:

[0037] lgp=AT -1 +BlgT+CT+D (1-1)

[0038] Among them, A, B, C, and D of various metals (this is the coefficient calculated by the saturated vapor pressure of the metal, each metal is different, can be found in the general manual, no need to explain) can be queried in the standard manual, According to the specific temperature, the saturated vapor pressure P of Cu and Mn can be calculated. a and P b . At the same time, considering that the mass ratio of Cu:Mn in the alloy is 4:1, the corresponding evaporation rate should be controlled at 4...

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Abstract

The invention discloses a charging method for preparing binary submicron metal alloy powder by using a physical vapor deposition method. The charging method comprises the steps that saturated vapor pressure of each metal element in the metal alloy powder in a certain temperature range is calculated, a degree of metal evaporation is judged, and according to content of each element in the metal alloy powder and the Raoult's law, the charging speed ratio of each metal element is calculated; according to charging ratio of each metal element, pure metal which contains a large proportion in the metal alloy powder serves as a main metal element and is added into a crucible inside a metal evaporating device in advance, the charging speed of small proportional metal, namely a secondary metal element and the charging speed of the main metal element are adjusted, then charging is conducted, and the submicron-class binary powder is obtained. According to the method, the binary submicron metal alloy powder which is even in ingredients can be produced effectively and continuously.

Description

technical field [0001] The invention relates to the technical field of submicron metal alloy powder preparation, in particular to a feeding method for preparing binary submicron metal alloy powder by physical vapor deposition. Background technique [0002] Submicron metal alloy powder is a functional basic powder material with high-tech content and high added value. It is also one of the fastest-growing hot products in the field of materials. It is used in high-performance electrode materials; chip multilayer ceramic capacitors; , anti-radiation functional fibers; high-efficiency catalysts; conductive pastes; powder forming, injection molding fillers; sintering additives, diamond tool manufacturing; metal and non-metal conductive coating treatment; special coatings, as selective solar absorbing coatings; absorbing waves materials; ferrofluid; combustion aids; magnetic materials; [0003] At this stage, the preparation of metal alloy powder mainly includes atomization method...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F9/12
Inventor 谢上川宋书清陈钢强孙运华
Owner JIANGSU BOQIAN NEW MATERIALS
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