Feeding method for preparing binary submicron metal alloy powder by physical vapor deposition
A physical vapor deposition and metal alloy powder technology, applied in the field of submicron metal alloy powder preparation, can solve the problems of irregular powder shape, failure to achieve alloy structure and performance, small scale, etc., and achieve stable metal element content and composition. The effect of uniform distribution and large particle size span
Active Publication Date: 2017-10-17
JIANGSU BOQIAN NEW MATERIALS
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Problems solved by technology
The chemical method prepares submicron or even nanoscale metal alloy powder through a series of chemical reactions according to the active order of the metal, but its scale is small and the shape of the powder is irregular, which is not suitable for large-scale industrial production.
[0004] At present, the physical vapor deposition method is an ideal method for large-scale production of submicron metal powder (for details, please refer to ZL201110119245.2, metal evaporation device and method for preparing ultrafine metal powder with the device), but this method is not suitable for preparing ultra-submicron metal powder. Pure metal powder is ideal, but there are big problems in the production of metal alloy powder
Because in the high-temperature gaseous state, the free energy of metal atoms increases, the chemical bonds are destroyed, single metal atoms are separated, and various metal vapors are presented. During the cooling process, the melting points of different metals are different, and they will be in order according to the melting point. Turning into a single metal liquid and then condensing into a solid, resulting in uneven composition of the metal alloy powder and failing to achieve the proper structural properties of the alloy
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Embodiment 1
[0035] Embodiment 1, feeding design of binary submicron Cu-20%Mn (ie Cu:Mn=4:1) alloy powder
[0036] The metal is vaporized after being heated to form a metal gas. The vapor pressure of different metal gases is different, which is mainly affected by the temperature. According to the Clausius-Claiplan equation and the modification of practical application, the relationship between saturated vapor pressure and temperature is as follows:
[0037] lgp=AT -1 +BlgT+CT+D (1-1)
[0038] Among them, A, B, C, and D of various metals (this is the coefficient calculated by the saturated vapor pressure of the metal, each metal is different, can be found in the general manual, no need to explain) can be queried in the standard manual, According to the specific temperature, the saturated vapor pressure P of Cu and Mn can be calculated. a and P b . At the same time, considering that the mass ratio of Cu:Mn in the alloy is 4:1, the corresponding evaporation rate should be controlled at 4...
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Abstract
A feeding method for preparing binary submicron metal alloy powder by physical vapor deposition, the steps include: calculating the saturated vapor pressure of each metal element in the metal alloy powder within a certain temperature range, judging the ease of metal evaporation, and according to the metal alloy The content of each element in the powder and Raoult's law calculate the feeding speed ratio of each metal element; then according to the feeding ratio of each metal element, the pure metal that accounts for a large proportion in the metal alloy powder is first added to the metal evaporation device as the main metal element In the crucible inside, adjust the feeding speed of the small proportion of metals, that is, the secondary metal elements and the feeding speed of the main metal elements, and start feeding to obtain binary alloy powder at the submicron level. The method can efficiently and continuously produce binary submicron metal alloy powder with uniform composition.
Description
technical field [0001] The invention relates to the technical field of submicron metal alloy powder preparation, in particular to a feeding method for preparing binary submicron metal alloy powder by physical vapor deposition. Background technique [0002] Submicron metal alloy powder is a functional basic powder material with high-tech content and high added value. It is also one of the fastest-growing hot products in the field of materials. It is used in high-performance electrode materials; chip multilayer ceramic capacitors; , anti-radiation functional fibers; high-efficiency catalysts; conductive pastes; powder forming, injection molding fillers; sintering additives, diamond tool manufacturing; metal and non-metal conductive coating treatment; special coatings, as selective solar absorbing coatings; absorbing waves materials; ferrofluid; combustion aids; magnetic materials; [0003] At this stage, the preparation of metal alloy powder mainly includes atomization method...
Claims
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IPC IPC(8): B22F9/12
Inventor 谢上川宋书清陈钢强孙运华
Owner JIANGSU BOQIAN NEW MATERIALS