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Manufacturing method of three-dimensional structure, three-dimensional structure manufacturing apparatus, and three-dimensional structure

A technology of three-dimensional modeling and manufacturing method, which can be used in processing and manufacturing, manufacturing tools, supply devices, etc., and can solve problems such as ineffective utilization of unbonded powder.

Inactive Publication Date: 2015-09-16
SEIKO EPSON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, in existing methods, unbonded powders are not effectively utilized

Method used

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  • Manufacturing method of three-dimensional structure, three-dimensional structure manufacturing apparatus, and three-dimensional structure
  • Manufacturing method of three-dimensional structure, three-dimensional structure manufacturing apparatus, and three-dimensional structure
  • Manufacturing method of three-dimensional structure, three-dimensional structure manufacturing apparatus, and three-dimensional structure

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0292] Tetrahydrofurfuryl acrylate: 36 parts by mass

[0293] · Ethoxyethoxyethyl acrylate: 55.75 parts by mass

[0294] Bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide: 3 parts by mass

[0295] 2,4,6-Trimethylbenzoyldiphenylphosphine oxide: 5 parts by mass

example 2

[0297] · Dipropylene glycol diacrylate: 37 parts by mass

[0298] ・Polyethylene glycol (400) diacrylate: 55.85 parts by mass

[0299] Bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide: 3 parts by mass

[0300] 2,4,6-Trimethylbenzoyldiphenylphosphine oxide: 4 parts by mass

example 3

[0302] Tetrahydrofurfuryl acrylate: 36 parts by mass

[0303] Acryloylmorpholine: 55.75 parts by mass

[0304] Bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide: 3 parts by mass

[0305] 2,4,6-Trimethylbenzoyldiphenylphosphine oxide: 5 parts by mass

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Abstract

Provided is a manufacturing method of a three-dimensional structure which manufactures a three-dimensional structure by laminating layers, the method including: forming the layers using a composition A containing three-dimensional formation powders and a solvent; discharging a binding solution for binding the three-dimensional formation powders to the layers; binding the three-dimensional formation powders by curing the discharged binding solution; removing the non-bound three-dimensional formation powders using the solvent; and additionally adding the three-dimensional formation powders to a mixed solution generated by the removing and containing the non-bound three-dimensional formation powders and the solvent, and preparing a composition B containing the three-dimensional formation powders and the solvent.

Description

technical field [0001] The invention relates to a method for manufacturing a three-dimensional shaped object, a device for manufacturing a three-dimensional shaped object and a three-dimensional shaped object. Background technique [0002] Conventionally, for example, there is known a method of forming a three-dimensional model based on a model of a three-dimensional object generated using three-dimensional CAD software or the like. [0003] As one of methods for forming a three-dimensional model, a lamination method is known. In the stacking method, generally after dividing the model of a three-dimensional object into multiple two-dimensional cross-sectional layers, sequentially shape the cross-sectional parts corresponding to each two-dimensional cross-sectional layer and sequentially stack the cross-sectional parts to form a three-dimensional modeling object . [0004] In the layering method, as long as there is a model of the three-dimensional shape to be shaped, the t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C67/00B22F3/115B33Y10/00B33Y30/00B33Y80/00B33Y70/00
CPCB22F1/0059B29C67/0085B28B13/02B29C67/0081B22F3/00B28B1/001B33Y10/00B33Y80/00B22F3/003B33Y30/00B29L2031/772B22F3/24B22F7/06B29C64/165Y10T428/24802Y10T428/24926Y02P10/25B22F10/14B22F10/73B22F10/43B22F10/62B22F10/68
Inventor 平田嵩贵
Owner SEIKO EPSON CORP
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