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Optical light color low stress modified epoxy adhesive and preparation of

An epoxy adhesive, low stress technology, used in adhesives, novolac epoxy resin adhesives, epoxy resin adhesives, etc. good question

Inactive Publication Date: 2009-01-21
云南光电辅料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] The purpose of the present invention is to provide a method to solve the problems of poor anti-aging performance of epoxy resin adhesives, large shrinkage of curing volume, easy deformation and excessive stress

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] Embodiment 1 (weight ratio)

[0037] Component A formula:

[0038] NPPR-133LEPU 60 TINUVIN 479 1

[0039] D.E.N 431 15 TINUVIN 152 1

[0040] D.E.R 732 14 Dibutyl phthalate 9

[0041] Component B formula:

[0042] T-403 70 K54 10

[0043] Ancamine 1561 20 DB-602 3

[0044]When preparing, put NPPR-133LEPU, D.E.N 431, D.E.R 732, TINUVIN 479, TINUVIN 152, and dibutyl phthalate into the reaction kettle, stir and mix evenly at 40℃~60℃, and use it as component A Standby; put T-403, Ancamine 1561, K54 and DB-602 in the reaction kettle and mix well, and use it as component B for spare use. When in use, mix uniformly according to A:B=3:1 (weight ratio) and it can be used for optical path bonding of optical components. After 24 hours of curing at room temperature, the shear strength is 15MPa, the transmittance in the visible light range is 95%, and the refractive index is 1.48~1.52.

Embodiment 2

[0045] Embodiment 2 (weight ratio)

[0046] Component A formula:

[0047] SL-102C 50 TINUVIN 152 1

[0048] F-48 20 Dibutyl phthalate 10

[0049] 662 20 A380 Fumed silica 3

[0050] TINUVIN 479 1 Silica powder 25

[0051] Component B formula:

[0052] T-403 75 DB-602 3

[0053] 593 epoxy curing agent 15 A380 fumed silica 3

[0054] K54 10 Silica powder 25

[0055] When preparing, put SL-102C, F-48, 662, TINUVIN 479, TINUVIN 152, and dibutyl phthalate in the reaction kettle, stir and mix evenly at 40°C~60°C, add A380 gas phase method Mix silicon dioxide and silicon micropowder evenly as component A for later use; put T-403, 593 epoxy curing agent, K54 and DB-602 in the reaction kettle and stir and mix evenly, add A380 fumed silica and silicon micropowder to mix Uniformly used as component B for later use. When in use, it can be used for bonding optical reflectors and aluminum mirror bases by mixing uniformly according to A:B=3:1 (weight ratio), and the shear strength i...

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PUM

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Abstract

The invention discloses a novel optical light-colored low-stress modified epoxy adhesive and a preparation method thereof. The adhesive consists of a composition A and a composition B, wherein the composition A comprises polyurethane modified epoxy resin (30 to 70 percent), novolac epoxy resin (20 to 40 percent), polyalcohol glycidol ether epoxy resin (10 to 30 percent), a mixed antiager (1 to 3 percent) and a plasticizer (5 to 20 percent), and the composition B comprises amine-terminated polyether (50 to 90 percent), a fatty amine epoxy hardener (10 to 50 percent), a silicane coupling agent (1 to 5 percent) and a curing accelerator (0 to 10 percent). The weight ratio of the composition A to the composition B is between 2.5 and 3.5 to 1, and the respective weight percentage of the two compositions is 100 percent. The epoxy adhesive prepared by the method has small shrinkage, good flexibility, small stress, strong bonding force, good weathering resistance and light color after cured, can be used for bonding a light path of an optical element with rigorous stress requirement and not high transmission requirement, and can be also used for bonding a non-light path of a precision optical instrument with rigorous stress requirement if a filler and a thixotropic agent are added.

Description

1. Technical field [0001] The invention relates to an adhesive, in particular to a light-colored low-stress modified epoxy adhesive used in the optical industry and a preparation method thereof. 2. Background technology [0002] With the continuous development and progress of optical instruments, the requirements for surface deformation of optical devices are getting higher and higher, and even the smallest deformation of the surface of optical devices may lead to changes in optical performance. Stress is the main cause of surface deformation of optical devices, especially thin-walled optical devices. When optical devices are connected, only special flexible connections such as adhesive bonding can be used instead of rigid connections such as screw threads, riveting, and welding. [0003] Among the adhesives used in modern optical instruments, modified epoxy resin adhesives, polyurethane adhesives, acrylic adhesives (UV adhesives, anaerobic adhesives, instant adhesives), neo...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J163/04C09J171/00
Inventor 句红兵罗海玲李妹明程荣梁李进伟
Owner 云南光电辅料有限公司
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