White-light LED area source and preparation method thereof
An LED surface light source, LED chip technology, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of large difference in LED light color, uneven coating, difficult dispensing amount, etc., to improve performance and uniformity. , to ensure the effect of consistency
Inactive Publication Date: 2015-09-16
HARVATEK OPTOELECTRONICS SHENZHEN
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Problems solved by technology
It is difficult to control the amount of glue dispensing in this process technology, which makes the difference in light color of LEDs produced in batches is large, and the phosphor powder is easy to precipitate, and the coating is uneven, resulting in poor consistency of phosphor powder distribution on the chip surface, resulting in a single light source. The overall luminous intensity and color temperature are unevenly distributed in all directions in space
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[0042] The preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, so as to define the protection scope of the present invention more clearly.
[0043] Please refer to attached figure 2, a white LED surface light source of the present invention, the LED surface light source includes a substrate 4 and an FR4 layer 5, the FR4 layer 5 is placed on the uppermost layer of the substrate 4, a groove is arranged on the FR4 layer 5, and the bottom surface of the groove It is a smooth plane, along the edge of the groove, a circle of plastic ring 8 is arranged, a number of LED chips 3 are fixedly arranged on the bottom surface of the groove, and the groove is filled with silica gel 6, and the silica gel 6 Fill until it is level with the groove, and spread a layer of fluorescent rubber cake 7 on the...
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Abstract
The invention discloses a white-light LED area source and a preparation method thereof. The LED area light source comprises a substrate and an FR4 layer. The FR4 layer is arranged at the top layer of the substrate; a groove is formed in the FR4 layer and the bottom of the groove is a smooth plane; and a plastic ring is arranged along the edge of the groove. A plurality of LED chips are fixedly arranged at the bottom of the groove. The groove is filled with a silica gel until the surface of the filled silica gel is flush with top of the groove. A fluorescent glue plate is laid on the upper surface of the silica gel and is fixed by a plastic cement ring. According to the invention, the distance between the wafer and the fluorescent powder particle is extended directly based on the fluorescent glue plate process and thus performance is substantially improved. With the novel fluorescent glue plate process, after refraction of the blue-light wafer by pure silica gel, light reaches a unified light emitting surface and then passes through the fluorescent glue plate, so that uniformity is substantially improved.
Description
technical field [0001] The invention relates to the field of LED lamps, in particular to a white LED surface light source and a preparation method thereof. Background technique [0002] The existing white light lighting technology based on light-emitting diode (LED) chips is simple and easy to use with blue LED chips and phosphor powder, and is the most widely used in research and application. The core of semiconductor lighting LED white light technology is the phosphor coating process. The controllability and uniformity of the phosphor coating thickness directly affect the brightness and chromaticity consistency of LED white light and the overall light output efficiency of the light source, and even affect To the color temperature stability and reliability of the light source during use. The existing phosphor powder coating technology is to fill the mixture of glue (epoxy resin, silica gel or silicone resin, etc.) Bubbles inevitably exist in the phosphor mixture. Afterwa...
Claims
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Login to View More IPC IPC(8): H01L33/50H01L33/00
Inventor 洪汉忠罗顺安许长征
Owner HARVATEK OPTOELECTRONICS SHENZHEN