Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

An epoxy resin composition suitable for high voltage surface mount device packaging

A technology of surface mount devices and epoxy resin, which is applied in the field of epoxy resin composition, can solve problems such as damage and electrical performance failure, and achieve the effects of low thermal weight loss rate, high glass transition temperature, and excellent high-voltage characteristics

Active Publication Date: 2018-07-27
JIANGSU HHCK NEW MATERIAL CO LTD
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

With the increase of working temperature, the epoxy molding compound in the prior art is prone to thermal decomposition, releasing some small molecular substances, which will cause the structure damage of the epoxy molding compound, resulting in the failure of electrical properties

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • An epoxy resin composition suitable for high voltage surface mount device packaging

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] Example 1, an epoxy resin composition suitable for high-voltage surface mount device packaging, the composition mainly includes: (A) epoxy resin; (B) curing agent; (C) curing agent accelerator; ( D) inorganic filler; (E) coupling agent; (F) stress absorber;

[0030] The (A) epoxy resin is one of the epoxy resins represented by formulas [1] and [2], and its content is 5% of the total mass of the epoxy resin composition;

[0031] The (C) curing agent accelerator is selected from the curing agent accelerator with the structure described in [4], and its content is 0.1% of the total mass of the epoxy resin composition;

[0032] The (B) curing agent is a phenolic resin represented by formula [3], and its content is 5% of the total mass of the epoxy resin composition.

[0033] The remaining raw materials are selected according to the conventional dosage.

Embodiment 2

[0034] Example 2, an epoxy resin composition suitable for high-voltage surface mount device packaging, the composition mainly includes: (A) epoxy resin; (B) curing agent; (C) curing agent accelerator; ( D) inorganic filler; (E) coupling agent; (F) stress absorber;

[0035] The (A) epoxy resin is one of the epoxy resins represented by formulas [1] and [2], and its content is 15% of the total mass of the epoxy resin composition;

[0036] The (C) curing agent accelerator is selected from the curing agent accelerator with the structure described in formula [4], and its content is 2.5% of the total mass of the epoxy resin composition;

[0037] The (B) curing agent is a phenolic resin represented by formula [3], and its content is 15% of the total mass of the epoxy resin composition.

[0038] The remaining raw materials are selected according to the conventional dosage.

Embodiment 3

[0039] Example 3, an epoxy resin composition suitable for high-voltage surface mount device packaging, the composition mainly includes: (A) epoxy resin; (B) curing agent; (C) curing agent accelerator; ( D) inorganic filler; (E) coupling agent; (F) stress absorber;

[0040] The (A) epoxy resin is a mixture of two epoxy resins represented by formulas [1] and [2], and its content is 10% of the total mass of the epoxy resin composition; wherein formula [1] represents The epoxy resin content is 6% of the total mass of the epoxy resin composition;

[0041] The (C) curing agent accelerator is selected from the curing agent accelerator with the structure described in formula [4], and its content is 1.5% of the total mass of the epoxy resin composition;

[0042] The (B) curing agent is a phenolic resin represented by formula [3], and its content is 10% of the total mass of the epoxy resin composition.

[0043] The remaining raw materials are selected according to the conventional dos...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention is an epoxy resin composition suitable for high-voltage device packaging, which mainly includes: (A) epoxy resin; (B) curing agent; (C) curing agent accelerator; (D) inorganic filler (E) coupling agent; (F) stress absorber; (A) is one or two kinds of epoxy resins represented by formula [1], [2], and its content is the total amount of epoxy resin composition 5%~15% of the mass; (C) The curing agent accelerator with the structure described in formula [4] is selected, and its content is 0.1%-2.5% of the total mass of the epoxy resin composition. The present invention is suitable for the epoxy resin composition of high-voltage surface-mount device packaging, because it has a high glass transition temperature and low water absorption rate, and at the same time, its structure is more stable than the existing general system at high temperature, and it is not easy to produce thermal decomposition. After 1000 hours at high temperature, its thermal weight loss rate is low, and it is not easy to produce small molecule thermal decomposition products, so that it has excellent high voltage characteristics.

Description

technical field [0001] The invention relates to an epoxy resin composition, in particular to an epoxy resin composition suitable for encapsulation of high-voltage surface mount devices. Background technique [0002] With the rapid development of the current electronic information industry, electronic components are developing in the direction of miniaturization, high power and high integration, and the production technology of chips has also penetrated into the sub-micron era. The advantages are clear, so the packaging technology for assembling with these tiny, ultra-thin dies becomes a real challenge. The package form also has the traditional through-hole package to the surface mount. Discrete devices, as the past and present of integrated circuits, play a pivotal and irreplaceable key role in many occasions such as high power, anti-high voltage, high frequency and high speed, radio frequency microwave, low noise, and high sensitivity. Therefore, the packaging technology ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08L61/10C08L83/04C08K13/02C08K5/50C08K3/34C08K5/5435C08K5/548C08K3/38C08K3/04
Inventor 李兰侠谭伟成兴明刘红杰陈畅崔亮李文翔蒋小娟
Owner JIANGSU HHCK NEW MATERIAL CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com