Preparation method for multilayer ceramic capacitor

A technology of multilayer ceramics and capacitors, which is applied in the direction of laminated capacitors, fixed capacitor parts, fixed capacitor dielectrics, etc., which can solve the problems of unfavorable environmental protection and sanitation, and increase the dust level of the production site.

Active Publication Date: 2015-09-30
GUANGDONG FENGHUA ADVANCED TECH HLDG
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Problems solved by technology

[0003] For the above-mentioned sintering consistency problem, this field usually adopts buried powder sintering method to solve, but buried powder sintering method will increase the dust degree of the production site, which is not conducive to environmental protection and sanitation

Method used

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  • Preparation method for multilayer ceramic capacitor
  • Preparation method for multilayer ceramic capacitor

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Embodiment Construction

[0027] The preparation method of the multilayer ceramic capacitor will be further described in detail below mainly in conjunction with the accompanying drawings.

[0028] combine figure 1 and figure 2 , the preparation method of the multilayer ceramic capacitor of an embodiment, comprises the steps:

[0029] S10, uniformly mixing the ceramic powder doped with the sintering aid, the binder, and the organic solvent to obtain a ceramic slurry, and then preparing a ceramic thin film by using the ceramic slurry as a raw material.

[0030] In this embodiment, the operation of uniformly mixing the ceramic powder doped with sintering aid, the binder, and the organic solvent is as follows: the ceramic powder doped with the sintering aid, the adhesive, and the organic solvent are uniformly mixed by ball milling , The ball milling time can be 10h ~ 16h.

[0031] In the ceramic slurry, the mass ratio of the ceramic powder doped with the sintering aid, the binder and the organic solven...

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Abstract

The invention discloses a preparation method for a multilayer ceramic capacitor. The preparation method comprises the following steps of preparing ceramic thin films and ceramic thin films on which inner electrode patterns are printed, wherein a plurality of ceramic thin films on which the inner electrode patterns are printed are laminated to obtain a laminating unit; respectively laminating a plurality of ceramic thin films on two opposite side faces of the laminating unit, and pressing in and cutting the ceramic thin films to obtain laminating bodies; laminating, pressing in and cutting the plurality of ceramic thin films to obtain green blocks; placing the laminating bodies and the green blocks on a load bearing board, wherein the laminating bodies are placed in a middle area, and the green blocks encircle the peripheries of the laminating bodies, and performing agglomeration discharging and sintering on the laminating bodies to obtain a ceramic body; after chamfering the ceramic body, attaching two outer electrodes at two ends of the ceramic body. According to the preparation method for the multilayer ceramic capacitor, during sintering, sintering-aid components in the green blocks volatilize, so that local atmosphere with higher volatile concentration is formed at the peripheries of the green bodies, and the ceramic body obtained by sintering is uniform, dense and good in consistency.

Description

technical field [0001] The invention relates to the field of electronic components, in particular to a preparation method of a multilayer ceramic capacitor. Background technique [0002] Copper inner electrode multilayer ceramic capacitors use copper with high conductivity as the inner electrode material, which has extremely low equivalent series resistance and is suitable for high frequency applications. In the preparation process of copper inner electrode multilayer ceramic capacitors, the sintering temperature of the ceramic dielectric material co-fired with the copper inner electrode cannot be higher than the melting point of copper, 1083 ° C, so generally more sintering aids are added than other ceramic materials. So that the ceramic dielectric material co-fired with the copper inner electrode can be sintered densely at a temperature lower than the melting point of copper. However, since the sintering aids tend to volatilize easily during high-temperature sintering, th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01G4/12H01G4/30
Inventor 陆亨廖庆文王艳红祝忠勇宋子峰刘新黄作权靳国境邓文华
Owner GUANGDONG FENGHUA ADVANCED TECH HLDG
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