Method for manufacturing three-dimensional circuit on surface of injection molded part

Abstract

The invention discloses a method for manufacturing a three-dimensional circuit on a surface of an injection molded part. The method comprises the steps of A. performing injection molding on a substrate layer through a double-material injection molding machine; B. performing injection molding on the upper surface of the substrate layer through the double-material injection molding machine for forming a metal powder injection-molded layer,, performing pressure-keeping cooling, and opening a mold for taking the injection molded part out; C. performing selective sintering on the metal powder injection molded layer on the surface of the injection molded part through the laser head a CO2 laser in a vacuum environment according to a pre-designed circuit wiring pattern path for forming a primary three-dimensional circuit; and D. performing electroless copper plating on the copper powder which is bared after laser sintering for obtaining an electroless copper-plated layer, thereby forming a copper lead. Relative to a traditional method for manufacturing the three-dimensional circuit, the method of the invention has a simple process and is suitable for high-precision batch production. According to the method of the invention, the three-dimensional circuit can be manufactured on the high-strength injection molded part, and use number of plate type printed circuit boards can be reduced, thereby reducing size and cost of an electronic product and satisfying a requirement for a specific structure.

Description

technical field [0001] The invention relates to a method for manufacturing a three-dimensional circuit, in particular to a method for selectively sintering the surface layer of an injection molded part containing metal copper powder by laser, and obtaining a copper wire by electroless copper plating, thereby manufacturing a three-dimensional circuit on the surface of the injection molded part. Background technique [0002] A three-dimensional circuit is also called a three-dimensional circuit, which refers to the use of certain processing methods on the surface of the injection-molded plastic shell to produce the required graphic wires, and then through the assembly of electronic components, the electrical interconnection of ordinary printed circuit boards Functions such as support, protection and protection of the plastic shell are integrated on one injection molded part to form a three-dimensional circuit carrier. [0003] The traditional methods of generating three-dimens...

AI Technical Summary

Problems solved by technology

This process can be used to produce three-dimensional circuits on some large injection molded parts, but is not suitable for manufacturing three-dimensional circuits on injection molded parts with complex structures

[0007] The above three traditional metallization methods on the surface of injection molded parts cannot meet the requirements of high-precision and flexible manufacturing due to the complicated manufacturing process, large loss of raw materials, and serious environmental pollution.

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