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A kind of method that improves glass transition temperature of epoxy resin composition

A technology of glass transition and glass transition temperature, which is applied in the field of increasing the glass transition temperature of epoxy resin compositions, can solve the problems of low Tg, low viscosity and high filler content of the cured product, and achieves low water absorption rate and high glass transition temperature. Effects of low temperature and stress

Active Publication Date: 2018-01-19
江苏旭远新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, epoxy resin compositions for three-dimensional high-density packaging require high filler content and low viscosity, so biphenyl type or multifunctional resins with low melt viscosity are generally used as the resin system, but due to the biphenyl type resin itself The molecular structure of the resin leads to a low Tg of the cured product, usually around 120°C. Even for multifunctional resin systems, the Tg is around 150°C. Therefore, there is room for further improvement of Tg

Method used

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  • A kind of method that improves glass transition temperature of epoxy resin composition
  • A kind of method that improves glass transition temperature of epoxy resin composition

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Experimental program
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Effect test

Embodiment 1

[0031] (1) First crush the raw materials that need to be crushed with a pulverizer;

[0032] (2) After the raw materials are baked and dried separately, set aside;

[0033] (3) Weigh the required filler and coupling agent according to the weight in Table 1, put them into a stainless steel mixer and mix vigorously for 15 minutes, and carry out surface modification treatment on the filler;

[0034] (4) Weigh the remaining materials one by one and put them into the mixer, and mix for another 25 minutes until uniform;

[0035] (5) Melt, knead and extrude the mixed raw materials with a screw extruder at 90-120°C, and cool them down;

[0036] (6) Crushing the cooled material, secondary mixing, and pre-pressing to obtain the corresponding epoxy resin composition, making the composition into a sample block of the required size, and testing its performance;

[0037] The test performance indexes of the epoxy resin composition prepared in this embodiment are shown in Table 2.

Embodiment 2

[0039] A method for improving the glass transition temperature of epoxy resin composition According to the steps described in Example 1, each component and its addition amount are as shown in Table 1, and the inspection performance index of the prepared epoxy resin composition is shown in Table 2 .

Embodiment 3

[0041] A method for improving the glass transition temperature of epoxy resin composition According to the steps described in Example 1, each component and its addition amount are as shown in Table 1, and the inspection performance index of the prepared epoxy resin composition is shown in Table 2 .

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Abstract

A method for increasing the glass transition temperature of an epoxy resin composition. It is characterized in that the matrix resin of the epoxy resin composition is epoxy resin, the curing agent is phenolic resin, and a glass transition temperature regulator is also included. The present invention reduces the hydroxyl content of the system by utilizing the reaction between the glass transition temperature regulator and the hydroxyl group produced after epoxy phenolic curing, so that the crosslinking system is subjected to secondary curing and crosslinking, and further increases the crosslinking density of the system to improve The glass transition temperature of the cured product reduces the water absorption rate of the cured product. The method is simple, easy and efficient, and the epoxy resin composition prepared by the method has the characteristics of high reliability, high glass transition temperature and low water absorption, and has broad application prospects in the field of three-dimensional high-density packaging.

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging materials, in particular to a method for increasing the glass transition temperature of an epoxy resin composition. Background technique [0002] The epoxy resin composition, usually the epoxy resin reacts with the curing agent (such as phenolic resin, amine compound) in the presence of a catalyst, and the epoxy functional group reacts with the phenolic hydroxyl group and amine group after ring opening, and then cures and crosslinks. Since the reaction will generate hydroxyl groups, the cured system contains a large number of hydroxyl groups, so the water absorption rate of the cured product is generally high, and these hydroxyl groups still have certain activity. [0003] With the rapid development of semiconductor packaging technology, especially the rise of high-density packaging, the requirements for packaging materials are also getting higher and higher. First of all, due to ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08G18/58C08G59/62
Inventor 封其立王宝总单玉来张德伟孙波周佃香王松松
Owner 江苏旭远新材料有限公司