Soft measurement method of mechanical parameters of the micro-motion stage of the mask stage of the lithography machine based on the compact particle swarm optimization algorithm

Abstract

The invention discloses a soft measurement method for mechanical parameters of a micro-motion stage of a mask stage of a lithography machine based on a Compact Particle Swarm Optimization algorithm, and belongs to the technical field of semiconductor manufacturing equipment and the field of mechanical parameter measurement. In order to solve the problem of poor accuracy of the existing mechanical parameter estimation algorithm of the micro-movement part of the workpiece table. The method includes the following steps: Step 1: According to the mechanical mechanism and theoretical design of the micro-motion stage of the mask stage, an ideal kinematics model of the micro-motion stage is established, the mechanical parameters to be measured are determined, and the inclusion difference of the micro-motion stage of the mask stage is established. Model; Step 2: Step 2: Given a position input, drive the micro-motion stage to generate displacement, and make a difference between the actual output displacement and the output displacement value calculated by the established mask stage micro-motion stage inclusion model, as an optimization The objective function; Step 3: According to the objective function, use the Compact Particle Swarm Optimization optimization learning algorithm to determine the mechanical parameters to be identified. It is used to obtain the mechanical parameters of the micro-motion stage.

Description

technical field [0001] The invention belongs to the technical field of semiconductor manufacturing equipment and the field of mechanical parameter measurement. Background technique [0002] As an important equipment for the production and manufacture of VLSI, the lithography machine has reached the nanometer level in terms of precision. As an important part of it, the precision requirements of the mask stage are also very high, especially the micro-motion stage part, which is the most directly related component to the accuracy of the mask stage system. As an electromechanical system, there are inevitably mechanical errors in the installation of the motor on the micro-motion stage of the mask stage and the processing of the stage body, which will lead to a decrease in the accuracy of the decoupling control according to the theoretical value. Therefore, these mechanical parameters must be accurately measured. However, the mechanical parameters involved in the motion model of...

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Problems solved by technology

[0004] The purpose of the present invention is to solve the problem of poor accuracy of the mechanical parameter estimation algorithm of the micro-movement part of the existing workpiece table. The present invention provides a soft measurement method for the mechanical parameters of the micro-motion stage of the mask table of the lithography machine based on the Compact Particle Swarm Optimization algorithm.

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