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A layered structure of spaced bus filter

A layered structure, bus filter technology, applied in the field of electronics, can solve the problems of poor filtering effect of EMI filter, large parasitic parameters, complicated parasitic parameter elimination technology, etc., to solve electromagnetic compatibility problems, improve stability, The effect of improving dissipation efficiency

Active Publication Date: 2017-11-07
NANJING UNIV OF AERONAUTICS & ASTRONAUTICS +1
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  • Abstract
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Problems solved by technology

[0003] Purpose of the invention: In order to overcome the deficiencies in the prior art, the present invention provides a layered structure of a spaced bus filter, which is used to solve the problem of poor filtering effect, large parasitic parameters, and Parasitic parameter elimination technology complex technical issues

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  • A layered structure of spaced bus filter
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  • A layered structure of spaced bus filter

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Embodiment Construction

[0015] The present invention will be further described below in conjunction with the accompanying drawings.

[0016] Such as figure 1 Shown is a layered structure of the intermediate space bus filter of the present invention consisting of 21 layers of materials. In this spaced bus filter layered structure, the first layer 1, the seventh layer 7, the fifteenth layer 15, and the twenty-first layer 21 are all copper layers; the second layer 2, the fourth layer 4, the The tenth layer 10, the twelfth layer 12, the eighteenth layer 18, and the twentieth layer 20 are all silver layers; the third layer 3, the eleventh layer 11, and the nineteenth layer 19 are all ceramic layers; the fifth layer 5. The ninth layer 9, the thirteenth layer 13, and the seventeenth layer 17 are all insulating layers, and the insulating layers are spliced ​​by insulating cloth and conductive adhesive; the sixth layer 6, the eighth layer 8, and the fourteenth layer 14. The sixteenth layer 16 is a nickel la...

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Abstract

The invention discloses a layered structure of an interval type bus filter, which is composed of twenty layers of layered materials, and the layers from the first layer to the twenty-first layer are copper layer, silver layer, ceramic layer, silver layer layer, insulating layer, nickel layer, copper layer, nickel layer, insulating layer, silver layer, ceramic layer, silver layer, insulating layer, nickel layer, copper layer, nickel layer, insulating layer, silver layer, ceramic layer, silver layer, Copper layer, in which the insulating layer is spliced ​​by insulating cloth and conductive glue. The structure contains 2 differential-mode capacitor units and 1 common-mode capacitor unit. According to the skin effect and proximity effect, the natural separation of noise current and working current can be realized, and the high loss characteristic of nickel can be used to achieve a certain resistance to noise current. loss, and also has the reflection effect of capacitance and inductance on noise.

Description

technical field [0001] The invention belongs to the field of electronic technology, in particular to a differential-mode and common-mode capacitor of an EMI filter. Background technique [0002] EMI filters are economical and reliable passive devices that effectively block the transmission of conducted electromagnetic interference. Under the assumption that the filter circuit has ideal impedance symmetry, the traditional EMI filter is usually decoupled into two parts, a differential mode filter and a common mode filter, and then the two parts are studied and designed separately. It is difficult to guarantee the impedance symmetry of the actual filter circuit. Even if the lead layout of the printed circuit board is completely symmetrical in geometry, the impedance asymmetry of the passive components themselves is also a factor that cannot be ignored. The asymmetry of the circuit impedance can easily cause the mutual conversion between differential mode and common mode noise,...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01P1/20
Inventor 王世山王文涛
Owner NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
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