The invention relates to a manufacturing process for chemically plating a NiP-Cu electrode on the partial surface of a ceramic element, in particular to a process for manufacturing an electrode by a chemical deposition method for base metal copper or nickel. The process comprises the following steps of: preparing the ceramic element, cleaning, drying, roughening, printing, activating, soaking, preplating, plating copper, dehydrating, drying, performing heat treatment, welding, testing and the like. The invention has the advantages that: a base metal layer on the surface of the ceramic element has high adhesion force and high performance and is easy to weld; the partial surface is chemically plated, so that the process is simple, and adhering, abrading and scattering processes of the conventional full electrode chemical plating process are eliminated; raw materials are saved, and the cost is reduced to one fifth of the original cost; and a plating solution formula is perfected, so that mass production of the electrode which is chemically plated on the partial surface of the ceramic element can be realized. The process is suitable for manufacturing electrodes of all ceramic elements.