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Manufacturing process for chemically plating NiP-Cu electrode on partial surface of ceramic element

A technology of ceramic components and surface chemistry, which is applied in the field of electroless plating NiP-Cu electrode manufacturing process on the local surface of ceramic components, to achieve the effects of easy welding, cost reduction and raw material saving

Active Publication Date: 2012-04-11
ANSHAN ZHONGPU INSTR ELECTRONICS EQUIP
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  • Claims
  • Application Information

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Problems solved by technology

For mass industrial production, the original method faces problems such as the stability of the plating solution, production repeatability, etc.

Method used

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  • Manufacturing process for chemically plating NiP-Cu electrode on partial surface of ceramic element
  • Manufacturing process for chemically plating NiP-Cu electrode on partial surface of ceramic element
  • Manufacturing process for chemically plating NiP-Cu electrode on partial surface of ceramic element

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Embodiment Construction

[0029] A kind of manufacturing process of electroless plating NiP-Cu electrode on the partial surface of ceramic element, comprises the following steps:

[0030] 1) Cleaning and drying: Ultrasonic cleaning is performed on the ceramic components to remove zirconium powder and suspended particles on the surface, and they are dried at 140-145°C.

[0031] 2) Coarsening treatment and cleaning: After roughening the ceramic components with acid, rinse them repeatedly with tap water for 8 to 10 times, then wash them with warm water at 30 to 40°C for 2 to 3 times, and then ultrasonically clean them for 20 to 30 minutes. Clean the acid solution remaining on the components to avoid poisoning the plating solution.

[0032] (1) Pb-free components: Prepare a roughening solution according to the ratio of fluoboric acid (analytical grade): pure water = 200ml: 1000ml, and roughen at 40-50°C for 10-20 minutes.

[0033] (2) Pb-containing components: prepare a roughing solution according to the ...

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Abstract

The invention relates to a manufacturing process for chemically plating a NiP-Cu electrode on the partial surface of a ceramic element, in particular to a process for manufacturing an electrode by a chemical deposition method for base metal copper or nickel. The process comprises the following steps of: preparing the ceramic element, cleaning, drying, roughening, printing, activating, soaking, preplating, plating copper, dehydrating, drying, performing heat treatment, welding, testing and the like. The invention has the advantages that: a base metal layer on the surface of the ceramic element has high adhesion force and high performance and is easy to weld; the partial surface is chemically plated, so that the process is simple, and adhering, abrading and scattering processes of the conventional full electrode chemical plating process are eliminated; raw materials are saved, and the cost is reduced to one fifth of the original cost; and a plating solution formula is perfected, so that mass production of the electrode which is chemically plated on the partial surface of the ceramic element can be realized. The process is suitable for manufacturing electrodes of all ceramic elements.

Description

technical field [0001] The invention relates to a manufacturing process of electroless plating NiP-Cu electrodes on the partial surface of ceramic components, in particular to a process of manufacturing electrodes with base metal copper or nickel by chemical deposition. Background technique [0002] For the metallization and sealing of ceramic components, the traditional method generally adopts the silver method. With the rising price of international bulk materials, silver has risen from 1,000 to 2,000 yuan per kilogram a few years ago to around 8,000 yuan per kilogram recently. The monthly cost pressure of purchasing silver paste for component manufacturers is self-evident. Therefore, the technology of replacing precious metals with base metals as the metallization and sealing technology of components is the development direction of the components industry in the future. In recent years, domestic counterparts have done a lot of work, such as full-electrode electroless pla...

Claims

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Application Information

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IPC IPC(8): C23C18/36C23C18/40C23C18/18
Inventor 杨新宇徐莹朴亚东张革王英男
Owner ANSHAN ZHONGPU INSTR ELECTRONICS EQUIP
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