Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Flexible lamp strip and machining method thereof

A technology of flexible light strips and flexible materials, applied in electrical components, electrical solid devices, circuits, etc., can solve the problems of limiting the light-emitting angle and light-emitting uniformity of lamps, increasing the cost of gold wires, and complicated processes, so as to increase the bonding Strength and thermal conductivity, saving gold wire cost, uniform luminous intensity

Inactive Publication Date: 2015-11-04
王志根
View PDF3 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the brackets used for 360° luminous filaments in the LED packaging industry are relatively hard materials (such as metal, glass, ceramics, etc.) No aesthetic effect, more limited the light emitting angle and light uniformity of the lamp, the intensity of light at each angle cannot be consistent, resulting in low brightness and low illuminance at some angles, and the 360° luminous effect cannot be achieved
[0004] At present, the packaging industry uses gold wires to connect ordinary light-emitting chips with the bracket circuit. This operation increases the cost of gold wires, the process is complicated, and it is the most problem-prone process in the packaging industry.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Flexible lamp strip and machining method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0019] Such as figure 1 As shown, the flexible light bar of the present invention includes a strip bracket 1 made of flexible materials such as plastic or silicone and a plurality of inverted LED light-emitting chips 2, and the LED light-emitting chips 2 are blue light chips or red light chips or green light chips Or purple chip. The outer surface of the bracket 1 is electroplated or sintered with a metal layer 3 by means of electroplating or sintering. The support 1 is also provided with positive and negative electrode conductive connection points (not shown in the figure), and the positive and negative electrodes of a plurality of LED light-emitting chips 2 are bonded together with the positive and negative electrode conductive connection points through silver paste, and heated by high temperature. The silver paste is cured by baking. A series circuit of at least one LED light-emitting chip 2 or a parallel circuit of at least two LED light-emitting chips 2 or a series-para...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a flexible lamp strip and a machining method thereof. The machining method of the flexible lamp strip comprises the steps of: plating or sintering a metal layer on a strip-shaped bracket made of flexible materials by adopting an electroplating method or a sintering method, and engraving positive and negative electrode conductive connection points on the bracket; adhering positive and negative electrodes of a plurality of inverted LED light emitting chips with the positive and negative electrode conductive connection points through a silver paste, and curing the silver paste through high-temperature baking to form a series circuit of at least one LED light emitting chip, or a parallel circuit of at least two LED light emitting chips or a series and parallel mixed circuit of a plurality of the LED light emitting chips; and fully wrapping the bracket, the metal layer and the plurality of LED light emitting chips by using a prepared fluorescent adhesive in a plastic-package fully wrapping manner. The flexible lamp strip can be bent into various shapes, light emitting intensities of 6 surfaces of the LED light emitting chips are even and the illumination at each corner is identical when the flexible lamp strip is bent and lightened, the machining method increases a binding force and thermal conductivity of the chips and the bracket, omits metal wire welding process, saves cost and increases product reliability.

Description

technical field [0001] The invention relates to a light bar, in particular to a flexible light bar and a processing method thereof. Background technique [0002] LED (Lighting emitting diode) is a light-emitting diode, a solid-state semiconductor device that converts electrical energy into visible light. It is a green light source with high energy saving, long life, high light efficiency and environmental protection. [0003] At present, the brackets used for 360° luminous filaments in the LED packaging industry are relatively hard materials (such as metal, glass, ceramics, etc.) The aesthetic effect is not enough, and the luminous angle and uniformity of the light are limited, and the intensity of light at each angle cannot be consistent, resulting in low brightness and low illuminance at some angles, and the 360° luminous effect cannot be achieved. [0004] At present, the packaging industry uses gold wires to connect ordinary light-emitting chips to the bracket circuit....

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/075H01L33/48H01L33/62
Inventor 王志根江涛林峰陈加海姜圣祥杜诚王芳
Owner 王志根
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products