Water-rich diabase and slate irregular mutual invasion rock shield residue soil improving method
A kind of muck improvement and diabase technology, which is applied in earth-moving drilling, mining equipment, tunnels, etc., can solve the difficulties in controlling the parameters and attitude of shield excavation, the long time for checking the tool and changing the tool, Problems such as the difficulty of opening a warehouse and changing a tool in a warehouse can improve the carrying capacity of packages, improve the parameters of shield tunneling, and reduce the sedimentation and consolidation of dregs.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment Construction
[0025] In a broad embodiment of the present invention, a method for improving water-rich diabase and slate irregular mutual intrusion rock shield with muck, through the filling channel of the cutter head panel and the radial arms on the front of the shield cutter head Hole position, the polymer filling system is used to fill high-volume high-molecular polymers into the dregs, and at the same time, through the filling channels and holes in the soil silo, the foam mixing system is used to add medium-concentration polymers to the dregs Foam for compound injection.
[0026] Slag improvement materials generally include surfactants (such as foaming agents), minerals (such as clay or bentonite), polymers (such as polymers) and other composite additives. The filling positions are generally the injection holes distributed on the cutter head panel, the soil bin partition and the screw machine cylinder. The material selection and filling method should be comprehensively considered accord...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com