Line information and non-line area information capturing method and line defect detecting method

Abstract

The invention mainly discloses a line information and non-line area information capturing method and a line defect detecting method. The line information capturing method comprises steps of processing a computer auxiliary designed picture into a skeleton picture, acquiring a circuit image, counterpointing the skeleton picture and the circuit image to enable each thin line of the skeleton of the skeleton picture to be corresponding to the interior of each line corresponding to the circuit image, and capturing line information of each line corresponding to the circuit image in the same coordinate position according to pixel point coordinate positions of each thin line of the skeleton, wherein the skeleton picture is provided with a skeleton formed by a plurality of thin lines; each thin line is a thin lined result of each line corresponding to the computer auxiliary designed picture; and the circuit image shoots according to a base plate manufactured based on the computer auxiliary designed picture.

Description

Technical field [0001] The present invention relates to a method for detecting or measuring circuits on substrates such as printed circuit boards, TFT panels, etc., in particular to a method that uses a skeleton to extract circuit images taken from the substrate and can be used for circuit defect detection or other applications. Method of application. Background technique [0002] In the existing printed circuit board integrated circuit manufacturing method, a conductor pattern is deposited on the printed circuit board. In recent years, the development of printed circuit board technology has brought the effective circuit layout space to the limit. For example, it is limited to the best circuit board. Density planning (the number of devices per square centimeter is gradually increasing), the fine line and space planning of the circuit board layout, the increase of spacing density grid array devices, etc., so the conductor pattern formed on the printed circuit board must be relativ...

AI Technical Summary

Problems solved by technology

[0002] In the existing printed circuit board integrated circuit manufacturing method, a conductor pattern is deposited on the printed circuit board to form it. In recent years, the development of printed circuit board technology has made the effective circuit layout space reach the limit. Density planning (the number of devices per square centimeter gradually increases), thin line and space planning of circuit board layout, increasing pitch density grid array devices, etc. Therefore, the formation of conductor patterns on printed circuit boards must be relatively miniaturized and the best layout should be planned Density, so it is easy to cause defects in the circuit on the printed circuit board, so it is often necessary to further inspect and test the circuit, but with the continuous improvement of production technology, the density and diversity of printed circuit boards are rapidly increasing. Defects on HDI boards and IC substrates cannot be accurately found by visual inspection. Therefore, automated machine vision inspection methods, such as Automated Optical Inspection (AOI) or Automatic Image Inspection (AVI), are used to detect printed circuit boards. Circuit defects on the board are quite common

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