Scintillator array and preparation method thereof
A scintillator and array technology, applied in the field of scintillation detectors, can solve the problems of reduced cutting precision and cutting efficiency, high proportion of scintillation medium, and increased production cost, and achieves the advantages of small material loss rate, reduced preparation cost, and simplified preparation process. Effect
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[0058] The present invention also provides a method for preparing a scintillator array, which can be used to prepare the above-mentioned scintillator array, comprising the following steps:
[0059] S100: Prepare a plurality of scintillator unit green bodies by using the unit preparation mold, and obtain a plurality of scintillator unit green bodies after sintering the plurality of scintillator unit green bodies.
[0060] see Figure 5 , using the base unit preparation mold 200 to prepare the scintillator base unit green body. The base unit preparation mold 200 includes a base unit template 210 and a base unit pressing plate 220. The base unit template 210 is provided with a plurality of first powder storage cavities 212 arranged in an array structure, and the first powder storage cavities 212 are used for preparing flashing The powder of the bulk unit (ie, the unit powder); the unit pressing plate 220 is used to squeeze the unit powder in the first powder storage cavity 212 ....
Embodiment approach
[0079] As another implementation manner, the above S200 includes the following steps:
[0080] S210': Arranging a plurality of scintillator units in an array structure, and then filling an adhesive between the plurality of scintillator units.
[0081] Specifically, multiple scintillator units can be arranged into an array structure by using a combined screening plate, and then introduced into a suitable cavity; then adhesive is poured into the gaps between the multiple scintillator units.
[0082] S220': After the binder is cured, a unit carrier is formed, and a plurality of scintillator units are spliced on the unit carrier to obtain a scintillator array. Since the binder has high bonding strength, after curing, multiple scintillator units are bonded together. Preferably, the binder is epoxy resin, which has better adhesion and higher light transmittance.
[0083] Preferably, when the binder is filled between multiple scintillator units, a reflective medium can be filled ...
Embodiment 1
[0089] (1) Preparation of scintillator elements
[0090]The matrix of the scintillator primitive is Y 3 Al 5 o 12 Transparent ceramics, the active ion is Pr 3+ , and Pr 3+ The doping amount is 0.15% of the molar weight of the matrix.
[0091] The preparation process is as follows: the base powder is prepared according to the composition ratio of the scintillator base; the base powder is ground, mixed and dried; the appropriate base preparation mold is selected, and the dried base powder is placed in the first In a powder storage cavity; cover the base unit pressing plate on the first powder storage cavity, apply a certain pressure, and obtain multiple scintillator base unit green bodies. The density of each scintillator element green body is 2.8g / cm 3 ; Place a plurality of scintillator element green bodies in a high-temperature furnace, sinter at 1750° C. for 2 hours, take out after cooling, and obtain a plurality of scintillator elements.
[0092] (2) Preparation of p...
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Abstract
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