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Lithography Production Control Method

A production control method and lithography technology, applied in the field of lithography machines, can solve problems such as inability to perform other operations, impact on the productivity of the lithography machine, etc., and achieve the effect of avoiding the waste of the productivity of the lithography machine

Active Publication Date: 2017-06-16
SHANGHAI HUALI MICROELECTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

During this period, the production capacity of the entire lithography machine was affected and other operations could not be performed. If the personnel who replaced the photoresist did not find out in time, the impact would be even greater

Method used

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  • Lithography Production Control Method
  • Lithography Production Control Method
  • Lithography Production Control Method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] Such as image 3 As shown, the lithography production control method provided in this embodiment is applied to lithography equipment, and the lithography equipment includes a glue development machine and an exposure machine, wherein, after the wafer is glued on the glue development machine, Enter the exposure machine for exposure processing, and then return to the gum-coating and developing machine for development.

[0023] Specifically, the lithography production control method specifically includes the following steps:

[0024] Step 1: Create a gumming and developing job. The gumming and developing job includes: gumming, exposure and development. The so-called creation of coating and development operations refers to determining the process parameters in coating, exposure and development operations according to the actual use and needs of the wafer.

[0025] Preferably, while creating the gumming and developing job, the lithographic equipment also creates a serial nu...

Embodiment 2

[0047] The difference between this embodiment and Embodiment 1 is that this embodiment can be applied to a machine specially responsible for coating photoresist. It specifically includes:

[0048] Step 1: Create a gluing job;

[0049] Step 2: Execute the gluing operation;

[0050] Step 3: Detect and judge whether the photoresist is insufficient in the gluing operation. If the photoresist is insufficient, the alarm prompts to replace the photoresist and enter step 4. If the photoresist is sufficient, directly enter step 5;

[0051] Step 4: Before changing the glue: cache the glue application progress of the current batch of wafers, and search for other batches of wafers in the lithography machine, and execute the glue coating operation; after changing the glue: load the glue coating cached before changing the glue Job progress, go to step 5;

[0052] Step 5: Proceed to the gluing job.

[0053] To sum up, when the lithography production control method of the present inventio...

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Abstract

The invention discloses a photolithography production control method, comprising: step 1: creating a glue application and development operation, the glue application and development operation includes: application of glue, exposure and development; step 2: executing the glue application operation; step 3: detecting and judging the coating Whether the photoresist is insufficient in the glue operation, if the photoresist is insufficient, the alarm prompts to replace the photoresist, and then go to step 4, if the photoresist is sufficient, go directly to step 5; step 4: before changing the glue: cache The gumming and developing operation progress of the current batch of wafers, and find the wafers whose gumming and developing conditions are inconsistent with the current batch, and perform the gumming and developing operation; after changing the glue: load the gumming and developing work progress cached before the glue is changed , return to Step 3; Step 5: Correspond the exposure condition to the gumming and development operation; Step 6: Execute the exposure operation and the subsequent development operation. The invention can enable the photolithography machine to work continuously without interruption, thereby improving the overall production capacity of the photolithography machine.

Description

technical field [0001] The invention relates to the field of photolithography machines, in particular to a photolithography production control method. Background technique [0002] In the field of semiconductor manufacturing, lithography is a crucial part. It is the process of transferring the circuit pattern on the mask plate to the wafer substrate. This process is usually completed by a lithography machine. The lithography machine is composed of two parts: a glue developing machine (Track) and an exposure machine (Scanner). After the wafer is glued in the glue developing machine, it is sent to the exposure machine after certain post-processing After exposure, the exposed wafer is sent back to the glue developer for development. The two parts of the machine have their own operating conditions. Generally speaking, these conditions are in one-to-one correspondence. [0003] Such as figure 1 As shown, the photoresist bottle 10 in the glue developing machine is connected with...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/20G03F7/16
Inventor 罗华明甘志锋毛智彪杨正凯
Owner SHANGHAI HUALI MICROELECTRONICS CORP