A cup structure that prevents high-pressure water mist from splashing

Abstract

The invention relates to a CUP structure for preventing high-pressure water mist splashing, including a CUP body, an exhaust port, an upper end cover, a door opening mechanism, a liquid pipe, a bottom plate, a wafer chuck, a nozzle, a motor and a driving mechanism, and the CUP body is installed on On the bottom plate, there is a wafer chuck inside which carries the wafer, and the wafer chuck is driven and rotated by a motor installed on the bottom plate; the driving mechanism is installed on the bottom plate outside the CUP body, and the liquid pipe is driven by the driving mechanism to move, and the upper end cover Installed on the CUP body, the upper end cover has a hole along the moving track of the liquid pipe, the liquid pipe is inserted into the CUP body through the hole, and a nozzle is installed; the liquid supply source for the liquid pipe to provide high-pressure liquid is located outside the CUP body, and the high-pressure liquid The liquid pipe is sprayed onto the surface of the wafer through the nozzle; the CUP body is equipped with a door opening mechanism and an exhaust port. The invention has the advantages of small size, simple structure, low processing and installation cost, etc., and is suitable for semiconductor equipment requiring high-pressure liquid functions such as deglue removal and cleaning.

Description

technical field [0001] The invention relates to a CUP structure for preventing high-pressure water mist splashing, which is suitable for semiconductor equipment using high-pressure liquids such as degumming or cleaning. Background technique [0002] In the cleaning and degumming process, high-pressure liquid is required to complete certain functions, and high-pressure liquid (usually using 5MPa~15MPa) impacts the surface of the wafer, splashing a large number of droplets and mist, and spreading to the wafer around. At present, in the equipment using high-pressure liquid, the common method is to use a completely closed process chamber, and integrate the wafer clamping mechanism, chemical supply mechanism, swing arm mechanism, etc. The control parts are well protected, and the cavity is completely sealed when using high-pressure liquid, which can not only ensure the safety of the moving structure in the cavity, but also completely control the spray and droplet splash generate...

AI Technical Summary

Problems solved by technology

Although this fully enclosed cavity structure can realize the function of preventing high-pressure water mist, but because the movement mechanism and the liquid supply mechanism need to be enclosed in the cavity, this causes problems such as the volume of the process cavity is too large and the equipment cost is high. , which is not conducive to the miniaturization and cost control of the machine

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