Pallet for printed-circuit board wave-soldering furnaces

Abstract

The present invention discloses a pallet for printed-circuit board wave-soldering furnaces including a rectangular bottom plate, a rectangular vertical frame and a rectangular special purpose bottom plate. The rectangular bottom plate is provided with a rectangular hole, the rectangular vertical frame connects the upper surface of the rectangular bottom plate and the periphery of the rectangular hole, the special purpose bottom plate is assembled in the rectangular hole of the rectangular bottom plate, and a printed-circuit board is arranged on the special purpose bottom plate and is fixed on the special purpose bottom plate through a limiting stopper and a printed-circuit board pressing buckle. The plan view size of the special purpose bottom plate is less than the size of the rectangular hole of the rectangular bottom plate, and a size adjusting component is connected between a pair of opposite edges of the rectangular vertical frame. The size adjusting component includes a movable bottom plate and a sliding holder, wherein, the sliding holder is connected to the upper side of the movable bottom plate so as to move in the rectangular hole of the rectangular bottom plate by the cooperation of the corresponding edge of the special purpose bottom plate. One pallet is suitable for printed-circuit boards with various sizes. The special purpose bottom plate can be adjusted according to various plate types, and a production department is only required to manage and store the special purpose bottom plate so that the storage space and the management difficulty are greatly reduced, the pallet production cycle is shortened and the pallet production cost is saved.

Description

technical field [0001] The invention relates to a plug-in wave soldering tooling in an electronic assembly process, in particular to a pallet for wave soldering. Background technique [0002] With the rapid development of science and technology, electronic components and printed circuit board technology are also developing in the direction of miniaturization and integration. Product design pays more and more attention to customer experience, and "Industry 4.0" even proposes a personalized and customized production method, which leads to rapid product replacement and a wide variety of products. This puts forward higher requirements for electronic assembly. SMT (Surface Mount Technology) is developing rapidly, and the placement rate of circuit boards is getting higher and higher, but there are still many high-power components that cannot be mounted by SMT and require plug-ins and wave soldering. The wave soldering of the printed circuit board needs to protect the SMT compone...

AI Technical Summary

Problems solved by technology

The use of special trays has the following disadvantages: 1. The production cycle of the tray is long and the cost is high; 2. Since each printed circuit board needs a special tray, the storage capacity of the tray is large, and special personnel are required to manage the tray and store it.

There are the following disadvantages in the use of selective wave soldering: 1. Selective wave soldering is an emerging technology, the technology is not mature enough, and the use is unstable; 2. A large amount of capital investment is required to replace wave soldering equipment; 3. Each printed circuit board needs to correspond to one Plan, when a new product is put into production, it takes a long time to make the plan

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