Cooling device for heat-generating element

Abstract

A cooling device for a heat-generating element, said cooling device being characterized by the provision of the following: a heat sink (5) on which the heat-generating element (2) is placed; a cooling structure (6) that is laid out so as to face said heat sink (5) and has a concavity (61) that, in combination with the heat sink, forms a coolant channel (7) through which a coolant can flow; and sealing members (8) provided between the heat sink (5) and the cooling structure (6) so as to seal the coolant channel (7), delineating the boundaries between the coolant channel (7) and the outside. This cooling device is also characterized in that the distances between the facing surfaces of the heat sink (5) and the cooling structure (6) near the sealing members (8) are longer inside the cooling channel (7) delineated by the sealing members (8) than outside said cooling channel (7).

Description

technical field [0001] The invention relates to a cooling device for heating elements. [0002] This application claims priority based on Japanese Patent Application No. 2013-085550 filed on April 16, 2013, and the contents described in the above application are incorporated by reference in the designated country where the incorporation of references based on documents is approved. It is included in this application as a part of the description of this application. Background technique [0003] As a cooling device for a heating element, there is known a device in which a heating element is placed on one side and a heat dissipation plate having a structure to dissipate heat is provided on the other side. As a cooling device for such a heat generating element, a cooling device using a heat generating element of a method (direct cooling method) in which a cooling structure having a concave portion is arranged so as to face a heat dissipation plate and a refrigerant flows throu...

AI Technical Summary

Problems solved by technology

Therefore, in the refrigerant flow path, a difference occurs in the concentration of dissolved oxygen in the refrigerant, thereby forming a concentration cell on the surface of the radiator plate, thereby causing localized corrosion (crevice corrosion) of the radiator plate.

Furthermore, when the localized corrosion of the radiator plate progresses, the pH in the refrigerant drops under the influence of the metal ions dissolved from the radiator plate, thereby causing the cooling structure to also corrode. Or the plating layer on the surface of the cooling structure is peeled off, resulting in liquid leakage from the sealed position

At this time, in the technique described in the above-mentioned Patent Document 1, a coating film is formed on the surface of the heat sink to prevent corrosion of the heat sink and the cooling structure, so there is a problem that it is disadvantageous in terms of cost.

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