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A kind of antioxidant suitable for snagcu or sncu solder and preparation method thereof

An antioxidant and solder technology, which is applied in the field of tin solder alloys, can solve the problems of alloy element burnout, hidden dangers of solder joint performance, etc., and achieve the effects of improved welding performance, good oxidation resistance and good fluidity.

Active Publication Date: 2017-09-26
NANJING TIN REFINING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Electronic companies have found in practical applications that Sn-Ag-Cu and Sn-Cu solders have more significant oxidation problems than traditional solders. In the wave soldering process, the amount of tin slag (the main component of tin slag is tin oxide) generally reaches 30% % to 40%, and may reach 50% in severe cases, especially under the condition of long-term high-temperature heating, along with the flow and stirring process, the alloying elements are severely burned, not only forming a large amount of tin slag, but also the material caused by different loss rates of various components Compositional changes can also pose potential hazards to solder joint performance

Method used

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  • A kind of antioxidant suitable for snagcu or sncu solder and preparation method thereof
  • A kind of antioxidant suitable for snagcu or sncu solder and preparation method thereof
  • A kind of antioxidant suitable for snagcu or sncu solder and preparation method thereof

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Effect test

preparation example Construction

[0021] The preparation method of the above-mentioned antioxidant suitable for SnAgCu or SnCu solder comprises the following steps: adding a certain amount of pure tin in the tin melting furnace, heating the tin melting furnace, when the temperature of the tin melting furnace is greater than 270 ° C, the weight of the pure tin 5.3% added CuBe foil strip 2 Master alloy (beryllium is 2% by weight), continue to heat the tin-melting furnace until the tin-melting furnace heats up to 400 ° C, start the mixer, and stir the mixed solution in the furnace (stir for 15 minutes), until the copper-beryllium master alloy in the furnace Completely melt, clean the scum on the surface of the molten liquid, and cast it, and cast it into a suitable weight according to the requirements of the follow-up process. At this time, the weight percentage of Be in the Sn-Be-Cu master alloy is 0.1%.

[0022] The preparation method of the above-mentioned antioxidant suitable for SnAgCu or SnCu solder compris...

Embodiment 1

[0024] Applications of the above antioxidants for SnAgCu or SnCu solders:

[0025] Add the antioxidant of the present invention (the weight percentage content of Be in this antioxidant is 0.1%) to Sn-3%Ag-0.5%Cu solder, according to wave soldering or immersion welding melting furnace melting tin weight, add this by 0.5% of soldering tin weight Antioxidants, put the antioxidants in a small colander, slowly immerse in the wave soldering or dip soldering molten tin, after 3-5 minutes, disturb the small colander to completely melt the antioxidants into the molten tin in the furnace, and clean the surface of the molten liquid A little scum, the weight percent content of Be in the molten tin is 0.0005%, and the Sn-3%Ag-0.5%Cu solder that has added the antioxidant of the present invention shows good oxidation resistance, such as image 3 Shown, add the solder surface oxidation 1h of antioxidant of the present invention and still keep better metallic luster.

Embodiment 2

[0027] Applications of the above antioxidants for SnAgCu or SnCu solders:

[0028] Add the antioxidant of the present invention (the weight percent content of Be in this antioxidant is 0.1%) to the Sn-0.3%Ag-0.7%Cu solder, according to the weight of the melting tin in the wave soldering or immersion soldering furnace, add this by 1% of the soldering tin weight Antioxidants, put the antioxidants in a small colander, slowly immerse in the wave soldering or dip soldering molten tin, after 3-5 minutes, disturb the small colander to completely melt the antioxidants into the molten tin in the furnace, and clean the surface of the molten liquid A little scum, the weight percent content of Be in the molten tin is 0.0010%, and the Sn-0.3%Ag-0.7%Cu solder that has added the antioxidant of the present invention shows good oxidation resistance, such as Figure 5 Shown, add the solder surface oxidation 1h of antioxidant of the present invention and still keep better metallic luster.

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Abstract

The invention discloses an antioxidant suitable for SnAgCu or SnCu solder. The antioxidant is Sn-Be-Cu intermediate alloy, wherein the alloy is prepared from, by weight, 0.1-0.25% of Be, 2-5% of Cu and the balance Sn. The invention further discloses a preparation method of the antioxidant suitable for the SnAgCu or SnCu solder. The antioxidant contains Be with the specific gravity smaller than that of Sn, Be has a small atomic radius, then Be can gather on the surface of the Sn-based alloy solder and also can fill up gaps in the surface of the Sn-based alloy solder, the combining capacity of Sn and O can be effectively isolated or weakened, and accordingly the solder has excellent anti-oxidation performance when the antioxidant is added into the solder; besides, Be will not increase the surface tension of the solder, then the solder has better fluidity, and accordingly the soldering performance of the solder is improved.

Description

technical field [0001] The invention relates to an antioxidant suitable for SnAgCu or SnCu solder, and also relates to a preparation method of the antioxidant, which belongs to the field of tin solder alloys. Background technique [0002] Since the EU legislation passed the RoHS / WEEE directive, there has been an upsurge of lead-free research worldwide. In particular, people's dependence on and use of electronic communication products has increased unprecedentedly, so the process of lead-free electronic products has attracted much attention. As the material with the largest proportion and amount of lead in electronic products, tin-lead solder (solder) is gradually replaced by lead-free solder. In recent years, lead-free solder has made great progress in both research and application. Among them, Sn-Ag-Cu-based and Sn-Cu-based solders have shown certain advantages in terms of comprehensive performance, and have become the mainstream direction in the field of lead-free solder...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/26
CPCB23K35/262
Inventor 陶卫建周健薛烽尹宏锐李勃陈旭白晶
Owner NANJING TIN REFINING CO LTD
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